We have published a new page introducing our low metal content and low odor technology on our company website under the "Research and Development / Technical Information" section.

[Sample Presentation] For metal-free applications of chemical agents in the manufacturing processes of electronic materials such as semiconductors and liquid crystals.

■Glycol Ethers High-quality glycol ethers with low metal management are widely used as solvents such as photoresists, strippers, cleaning agents, and etchants in manufacturing processes for semiconductors and liquid crystals. We offer a rich selection of high-quality glycol ethers with each metal managed at the ppb level, and a wide range of structures and boiling points is available. Additionally, by consistently handling raw material procurement, synthesis, and distillation, we meet the stringent quality control requirements of our customers in the electronic materials industry through a robust traceability system. We aim to achieve ppt level management through further enhancements to our management system. ■Amines We also conduct low metal management for the amines we manufacture. They are used as additives in semiconductor manufacturing process chemicals. For amines not produced by us, we can provide low metal management products that meet customer requirements through purification, so please feel free to consult with us. *For more details, please download and view the PDF materials.

• Wafer
• Chemicals
• Cleaning agents

By utilizing our unique refining technology, we have significantly reduced odor components, making it suitable for daily necessities and bath/toilet cleaning agents.

For cosmetic and toiletry applications, conventional industrial glycol ethers often have a strong odor, and there has been a demand for low-odor variants. Our company offers a special grade product that significantly reduces odor components through our unique refining technology. *For details on products and developments, please download the PDF and check. Feel free to request samples or consultations.*

• plastic
• Other polymer materials
• Chemicals

Our company produces an unparalleled variety of products in the world.

This product line produces an unparalleled variety of types worldwide. Furthermore, through our unique refining technology, we produce low-odor, low-metal glycol ethers. Glycol ethers are primarily used as solvents in paints, inks, detergents, and electronic materials. Among glycol ethers, dialkyl glycol ethers not only dissolve resins but also disperse metals, making them useful as solvents in electronic materials and for pharmaceutical synthesis. Additionally, aromatic, aliphatic, and ester glycol ethers are mainly used as raw materials for resins such as acrylics and polyesters. <Applications/Examples of Achievements> Plasticizers, diluents, film-forming aids, solder, reaction solvents for pharmaceuticals and organic synthesis, brake fluids, cleaning agents, for semiconductors and electronic materials, and more. *For more details, please download the PDF document for your review. We offer free samples upon request. Feel free to contact us for product selection, SDS, regulatory information, contract manufacturing, domestic production support, BCP measures, and more.

• Chemicals

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)