Dap Corporation's AS5643 compliant products for the next-generation combat F-35.

Analyzer package for the AS5643 avionics data bus adopted in the F-35 project.

The AS5643 I/F board comes in USB, LAN, and PCI/cPCI types. The AS5643 supports speeds of 100/200/400/800 bps. The bus analysis analyzer software FireSpy Mil1394 provides functions for Monitor, Recorder, Commander, Generator, Filter/Trigger, and Scriptor. ■ Japanese technical documentation for the AS5643 is available. If you would like to see it, please contact sales@nacelle.co.jp. Alternatively, it can also be downloaded from the catalog page.

• Other network tools

The FireStealthFS810bN is the world's first IEEE-1394b analyzer equipped with a "stealth mode."

DapTechnology's FireStealth810bN is the world's first "stealth mode" IEEE-1394b analyzer equipped with non-intrusive bus monitoring technology. The FireStealth IEEE-1394b analyzer does not participate in the bus topology, so topology reconfiguration and node ID reassignment do not occur. It becomes invisible to all other devices on the bus and does not participate in bus management activities such as root contention, cycle start generation, and transmission arbitration. FireStealth is a compact device equipped with 1024MB of internal memory. This device provides extensive hardware filtering and triggering through efficient FPGA and onboard processors. It supports transfer rates of up to 800MB. FireStealth connects to a host PC via USB2.0 or Ethernet. The GUI software operates on Windows and is intuitively operable. Additionally, the included API allows for the development of custom control software using C/C++ or LabVIEW.

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FireSpy 3422bT/3822bT is an analyzer package for the avionics data bus AS5643.

The FireSpy3822bT and FireSpy3422bT bus analyzers are the latest 3-bus IEEE-1394 protocol analyzers. The FireSpy3422bT/3822bT is based on the fourth generation of FireSpy analyzer architecture and is the most advanced 1394 test device. With seamless integration of the SAE AS5643 protocol, the FireSpy3422bT/3822bT has become a suitable tool for many aerospace and defense development tasks. DapTechnology continuously updates the analyzer's capabilities in accordance with implementation requirements and ongoing standardization efforts to fully support the AS5643 protocol across all major functional areas of the FireSpy3x22bT. The FireSpy3422bT/3822bT is equipped with 5GB of internal memory and can be connected to a host computer using a PCIe interface. On the host, the FireSpy can be controlled using a graphical user interface, allowing for the analysis and display of bus traffic in a user-friendly manner.

• others

FireLink is a link layer controller IP core compliant with IEEE-1394b.

FireLink, a synthesizable IEEE-1394-2008 beta link layer controller (LLC) core, is based on the link layer controller that has been used in DapTechnology's FireSpy analyzer products for several years. FireLink is a mature core implemented on FPGAs from Xilinx, Altera, and Microsemi. FireLink is available in three configurations: Basic, Extended, and GPLink. ■Japanese technical documentation for AS5643 is available. If you would like to see it, please contact sales@nacelle.co.jp■

• others

● The production time for casting prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly creating sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be created in a single molding process. This allows for the verification of multiple types in a short period.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Dear Sir/Madam, I would like to express my congratulations on the continued prosperity of your company. Thank you very much for your exceptional support. We would like to inform you that our company will be closed for winter holidays during the following period. We apologize for any inconvenience this may cause and kindly ask for your understanding. 1. Winter Holiday Period From Thursday, December 28, 2023, to Thursday, January 4, 2024. 2. Business Operations After the Winter Holiday Period We will resume normal operations from Friday, January 5, 2024.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.