Announcement of the release of the ultrasonic wall thickness measurement system for steel pipes and resin pipes.

Also for replacing existing equipment! Capable of supporting various inline specifications with a rich array of interfaces.

We would like to introduce our "Pipe Inline Ultrasonic Thickness Measurement Device." This device allows for the non-destructive and easy measurement of the thickness of pipes (steel pipes, resin tubes, etc.) using the ultrasonic echo method. It can measure the thickness of materials during transport and detect and record abnormalities such as upper and lower limits of thickness and uneven thickness with high precision. Additionally, it supports various inline specifications due to its rich interfaces (thickness value analog output, upper and lower limit event output, uneven thickness event output, etc.). 【Overview Specifications (Excerpt)】 ■ Number of Channels: 4ch (expandable in 2ch units) ■ Material Sound Velocity: 100–15,000 m/s ■ Thickness Measurement Range: 1–5,800 mm (calculated at a sound velocity of 2,400 m/s) ■ Thickness Measurement Resolution: Less than 1/100 mm (when measuring PVC pipes) ■ Gain: 0–110 dB (0.1 dB steps) *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic measuring instruments

Built-in probe switching function! Up to 4 channels can be switched.

We would like to introduce our digital ultrasonic flaw detector, the 'UI-180N'. This product is designed for automatic inspection of welded parts from electron beam and laser beam processing machines, checking for welding depth, misalignment, blowholes, and cracks. It allows for the connection of an external VGA monitor, enabling the display of inspection results on a large screen. Please feel free to contact us if you have any inquiries. 【Features】 - The display uses a 6.4-inch TFT color LCD to enhance visibility. - It is possible to connect an external VGA monitor. - It has a built-in transducer switching function, allowing for switching up to 4 channels. - The interface specifications with the control panel are compatible with the UI-180. - The operation keys on the panel are displayed in Japanese, improving usability for setting inspection conditions and other operations. *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Flaw detection testing

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)