Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other processing machines
• Other cutting tools

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• Resist Device
• High pressure cleaner

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• Resist Device
• Other semiconductor manufacturing equipment
• High pressure cleaner

Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

**Exhibition** Exhibition Information: Adhesive and Bonding Technology Exhibition 2024 Osaka Industry Creation Center, 3F・4F *Reception on 4F 〒541-0053 1-4-5 Honmachi, Chuo Ward, Osaka City **Date and Time** December 12, 2025 (Friday) 13:30 - 16:30 **Transportation** Get off at Osaka Metro "Sakaisuji-Honmachi Station" Central Line Exit 1, Sakaisuji Line Exit 12, each about a 5-minute walk **Exhibition Content Description** Integrated molding of insulation, bonding, and lightweight polyurethane **Exhibits** Rigid polyurethane molded products High-quality insulated bath covers Cooler boxes Vacuum insulation material encapsulated panels Insulated resin tanks

[Exhibition Display] Demonstration of pineapple adhesion dynamics using collaborative robots Dynamic display using collaborative robots and tool changers for gripping Static display of a 5kg dual-sided gripper Comparison of ejector compressed air consumption Various suction pads Foam gripper, etc. We recommend visiting on the first or second day when you can view the exhibits with relative ease. *The third day (Friday) is expected to be very crowded. 【Gripper Sale Event】 We will be selling the following two products at a discounted price at the exhibition booth. Please inquire about the special prices at the venue. ■ 'KENOS Gripper KVGL.400.100, N214.FR6.S2' URL: https://www.youtube.com/watch?v=HsNRwrDtjW0 ■ 'Collaborative Robot Hand KCS.Q110.N301.110.FR6.SX422.V1.X.X' URL: https://www.youtube.com/watch?v=GFKg3blZzdQ These products are ideal not only for actual applications but also for use as test machines. How about taking this opportunity?

Starting with our first PEEK-compatible 3D printer, the "G-ZERO MP1," the G-ZERO series of domestically produced 3D printers achieves industry-leading printing speeds as a super engineering plastic-compatible machine using the FFF method. Furthermore, by optimally combining with the high-performance resin POTICON filament, it simultaneously realizes fine detail, high rigidity, and high strength, enabling high-performance printing at a practical level. In this presentation, we will discuss the future of robotics that the G-ZERO series and POTICON FILAMENT will pave the way for. Details https://irex.nikkan.co.jp/webinar/detail/1509

We are pleased to announce a web seminar hosted by our company. 【New Plan "Mojitori Plus" Launch! From Paper to Data! The First Step Towards In-House DX with Mojitori】 'Mojitori' allows you to convert text from photos, images, PDF files, and more into data, automatically inputting it into various fields in kintone. In this seminar, we will clearly explain the basic functions and usage of Mojitori. Additionally, we will provide detailed explanations about the Plus plan and the document-focused Mojitori that were added in the major update in November. 【Recommended for the following people】 - Those who are struggling with frequent transcription errors due to manual data entry - Those who want to digitize items currently stored on paper 【Timetable】 - About Mojitori's functions - About Mojitori Plus's functions - Details and pricing of each plan - Q&A session We look forward to your registration.

The international standard for information security, "ISO27001," is an essential standard for gaining trust from business partners and reducing the risk of information leaks. In this seminar, we will clearly explain everything from the basic knowledge of the standard to the acquisition process and the specific effects of implementation. It is a must-see for companies and organizations looking to strengthen their security measures! ▶ For details and registration, please click the "Details and Registration" button below.