Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other processing machines
• Other cutting tools

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• Resist Device
• High pressure cleaner

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• Resist Device
• Other semiconductor manufacturing equipment
• High pressure cleaner

Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

[Speaker] Yohei Katakawa, Manager, Global Affairs Division, Marubeni Corporation Senior Researcher, Marubeni Institute of Economic Research [Key Lecture Content] The electric vehicle (EV) market is showing signs of demand stagnation globally, but the shift towards EVs in Europe continues unabated. On the other hand, the rapid shift to EVs and the rise of Chinese manufacturers have put European automakers in a difficult position. With the automotive and battery industries becoming a battleground for geopolitical and economic security issues, as exemplified by China's rare earth export regulations and Trump-era tariffs, how should we interpret the signs of future market changes? Considering the trends in new industrial policies, we will examine the environmental changes surrounding the European market and implications for the future. [Lecture Items] 1. Current state of the European automotive and battery industry 2. Green policies 3. Economic security policies 4. Shift towards competitiveness-focused policies 5. Implications for the future considering the geopolitical environment 6. Q&A / Business card exchange

[Instructor] Toshiya Araki, Copywriter, Dentsu Inc. [Key Lecture Content] "For all business people struggling with the inability to articulate what they want to say..." The ability to verbalize is a skill that anyone can acquire through very simple training. The Dentsu copywriter, author of the bestsellers "People Who Can Verbalize Instantly Succeed" (over 150,000 copies sold) and "This is How to Verbalize What's in Your Head" (over 100,000 copies sold), will introduce a newly developed training based on his experience conducting verbalization workshops with over 2,000 business professionals. The key is to follow the three steps of "concretization" → "abstraction" → "balancing concretization and abstraction." Just by doing this, anyone can come up with, organize, and communicate what they want to say. During this seminar, we will also engage in practical exercises to experience the methods and effects of verbalization training together. Please take home useful tips that will benefit your daily work.

[Speaker] Ren Taro Hayashi, Senior Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Lecture Items] 1. Overview of Data Centers 2. Impact of Data Centers on the Power Industry 3. Policy Trends in Data Centers and Power (1) Expert Meeting on Digital Infrastructure Development (2) GX2040 Vision (3) Public-Private Dialogue on Watt-Bit Collaboration (4) GX Industry Location Working Group 4. Future Approaches to Power Procurement for Data Center Development 5. Q&A / Business Card Exchange

[Lecturer] Masanao Moriwaki, Head of the International Nuclear Technology Division, Hitachi GE Vernova Nuclear Energy, Inc. [Key Lecture Content] In light of the rapidly expanding demand for electricity, the realization of a decarbonized society, and energy security, Small Modular Reactors (SMRs) are gaining attention as a stable decarbonized power source. In Ontario, Canada, construction has begun at the Darlington site of Ontario Power Generation (OPG) for the BWRX-300, promoted by GE Vernova Hitachi Nuclear Energy (GVH), which is the first SMR in Western countries. This seminar will introduce the technical features and implementation status of the BWRX-300, as well as organize the potential and challenges faced by SMRs, explaining how the BWRX-300 aims to address these challenges.