Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other processing machines
• Other cutting tools

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• Resist Device
• High pressure cleaner

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• Resist Device
• Other semiconductor manufacturing equipment
• High pressure cleaner

Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

Our company, the Steel Strip Company, will exhibit at the International Hydrogen Fuel Cell Expo in February 2024. We will showcase stainless steel strips for fuel cell separators.

[Speaker] Fujikei Co., Ltd. Mobility Solutions Division Chief Harunobu Okubo [Key Lecture Content] The thermal management system for EVs is being integrated with the aim of reducing weight, saving space, and cutting costs and labor. Due to fluctuations in EV demand, the market is undergoing significant transformation, requiring suppliers to offer a diverse range of products and make stringent investment decisions. Additionally, with the increase in heat generation from core components, heat dissipation materials are polarizing into high heat dissipation, high value-added products and low-cost, mass-consumption products. This seminar will introduce trends in the chaotic recent EV thermal management market from both the overall structure and key component perspectives. [Lecture Items] 1. Background and overall structure of the thermal management market 2. Market trends of core components (cooling and heating materials) 3. Market trends of heat dissipation materials 4. Market trends of battery fire-resistant insulation materials 5. Outlook and fluctuating factors of the thermal management market 6. Q&A / Business card exchange

[Speaker] Yuko Okada, President and CEO, M's Communicate Inc. [Key Lecture Content] In recent years, the renewal of point services has accelerated across various industries. The underlying trend is a significant shift where points have evolved from mere promotional measures to a strategic foundation for building relationships with customers. In this seminar, we will systematically organize the essence of this evolution based on the concept of 'Point Service 3.0'. We will explain the sources of effectiveness based on behavioral economics, the latest trends by industry, and the perspectives required in the era of engagement, while exploring the potential and direction of point services moving forward. [Lecture Items] 1. Evolution of Point Services (1.0 to 3.0) 2. Understanding the Essential Effects of Points through Behavioral Economics 3. Current Status and Strategic Choices of Common Points and Proprietary Points 4. Case Studies of Evolution in Point Services by Industry 5. The Era Where UI/UX Determines the Value of Points 6. Expansion into BtoB and BtoE and Applications for Organizational Activation 7. New Possibilities Unlocked by Future Point Services 8. Q&A / Business Card Exchange

[Speaker] Yuka Sawai, Team Leader of Biodiversity, Sustainability Consulting Office, Dentsu Inc. [Key Lecture Content] In this lecture, we will introduce the current state of biodiversity in Japan while unraveling the changing values of "coexistence with nature" that are emerging among future consumers. Through quantitative and qualitative research targeting university students, we will reveal signs that the values sought in coexistence are shifting towards "multi-well-being." We will organize the potential that nature holds for consumers and explain how a company's attitude towards "coexistence with nature" can influence its evaluation, especially now that sustainability has become the norm. Additionally, we will present five perspectives for translating the value of coexistence into a company's strengths.

Silver Son Nippon Co., Ltd. will be exhibiting at FOOMA JAPAN 2026, one of the largest food manufacturing exhibitions in the world, held in June! This year's theme for FOOMA is 'The Shift is On.' We will face the turning point in the food manufacturing industry and discover and create new value as a 'starting point for change.' We will showcase our Flash Mix, which demonstrates powerful performance even with difficult-to-handle powders, and batch mixers that are widely adopted by major food manufacturing companies. We invite you to see the actual products and experience the power of our high-shear mixers.