Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other processing machines
• Other cutting tools

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• Resist Device
• High pressure cleaner

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• Resist Device
• Other semiconductor manufacturing equipment
• High pressure cleaner

Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

Our company will be exhibiting at the "1st Mobility Material Exhibition during High-Performance Material Week." We sincerely look forward to your visit.

[Speaker] Yuichi Ikejiro, Deputy Director, Innovation Center, NTT Docomo Business Inc. [Key Lecture Content] NTT Docomo Business is responsible for corporate ICT business within the NTT Group. It provides a one-stop solution for corporate clients across the entire group, aiming to solve social issues and become a platform for industrial and regional digital transformation (DX) through support for large enterprises and local small and medium-sized enterprises. In this context, the Innovation Center plays a role in exploring and nurturing new business ideas, driving the creation of new businesses and their implementation in society. In this lecture, I would like to introduce the initiatives aimed at creating new businesses utilizing advanced technologies such as AI and IOWN that are promoted by the Innovation Center. [Lecture Items] 1. About NTT Docomo Business / Innovation Center 2. Technology roadmap looking towards 2030 3. Creation of new businesses through open innovation 4. Value creation promoted through design thinking 5. Initiatives for business creation utilizing advanced technologies such as AI, IoT/OT, and IOWN 6. Q&A / Business card exchange

[Speaker] President and CEO of ICT Solution Consulting Co., Ltd. / Creator Takashi Tominaga [Lecture Topics] 1. Review of last year's future predictions 2. Signs of a major upheaval (from 10 news stories) 3. Background of the major upheaval (triggered by Trump 2.0) - The U.S.-China space war and the emergence of disruptors (not innovators but destroyers) - Disruptors' destructive business models (subscription services, overwhelming cost competitiveness) 4. The essence of the major upheaval - The intersection of two massive revolutions (VC revolution and operation revolution) 5. What the major upheaval brings (making industry hierarchy (scale) meaningless) - Industries disintegrating (the risk of existing industries being taken over by platforms, especially in finance, healthcare, administration, national defense, IT, etc.) - Companies disintegrating (the possibility of bankruptcies of companies exceeding one trillion yen, encirclement by disruptors from small and medium-sized enterprises with technology) - Operations disintegrating (operation models using minimal human resources) - Employees disintegrating (the disappearance of the middle class, talent filtering by AI) 6. Overcoming the major upheaval and the concept of transformation (metamorphosis) 7. Q&A and business card exchange

[Instructor] Ryo Sekiguchi, Attorney at Horii Law Office (Japan/New York State) [Key Lecture Content] Against the backdrop of rapid technological advancements and the spread of cashless payments, services related to fund settlement have rapidly diversified, with payment methods utilizing decentralized ledger technology, such as stablecoins, emerging recently. On the other hand, with the diversification of payment and remittance services, providers of fund settlement services are required to comply with various financial regulations from the perspectives of user protection, prevention of fraudulent use, and AML/CFT, among others. These legal regulations have also been frequently amended recently. Most recently, a law partially amending the Fund Settlement Act was enacted in June 2025, with implementation scheduled for this year. Therefore, in the fund settlement business, it is essential to properly understand various legal regulations and to always pay attention to trends in the amendments of these regulations. In this seminar, we will briefly explain the overall picture of financial regulations related to payment and remittance businesses, and we will focus on explaining various remittance and payment services, particularly those parts affected by recent legal amendments.

This is an announcement for a webinar that is a must-see for those considering improving efficiency and stabilizing quality in manufacturing sites. We will be holding the highly praised "Production Guidance System" seminar from IIFES as a special webinar this time. If you have concerns such as: - "I want to eliminate variations in work quality" - "I want to prevent skipping processes and mistakes" - "I want to achieve efficient production even with a labor shortage" this may provide hints for solutions, so we look forward to your registration! 【Date and Time】 February 3, 2026 (Tuesday) 16:00 - 16:40 【Content】 1. Challenges in manufacturing sites and an overview of the guidance system 2. Three features that realize "anyone can do it, without mistakes, efficiently" 3. Case studies of implementation within SANYO Electric 4. Examples of system configuration