We will be exhibiting at the 4th Fine Chemical Japan 2021.

The highest pressure in Japan! 250MPa!

Dispersing, emulsifying, and breaking down are performed at a high pressure of up to 250 MPa. Equipped with an H-type nozzle (for dispersing, emulsifying, and breaking down), the sample is pressurized by a high-pressure pump and passes through the H-type nozzle, allowing for efficient dispersion, emulsification, and breakdown of uniform fine particles. 【Features】 ○ Easy dispersion of nanoparticles ○ Minimal contamination ○ Difficult to reaggregate, stable for a long time ○ Surface condition of the sample remains unchanged ○ Can perform kneading *For details, please download the catalog from the link below.

• Mixer/agitator

Challenging "difficult nano-micronization and nano-dispersion" with high technical capabilities! We will assist in solving our customers' challenges - we also accept contract testing and contract processing.

The "NAGS Series" is a wet-type ultra-high pressure homogenizer that supports the development of high-performance materials for our customers. The "NAGS20" is equipped with our uniquely developed H-type nozzle, which allows samples pressurized by a high-pressure pump to pass through the H-type nozzle, efficiently achieving uniform dispersion, emulsification, and disintegration of fine particles. It is also capable of handling high-concentration (below 60%) and high-viscosity (below 100,000 cP) samples, making it suitable for processing small amounts of samples. It is an electric tabletop model that achieves high-pressure processing of 200 MPa. The "NAGS100" and "NAGS1000" are also equipped with our uniquely developed H-type nozzle, making it easy to scale up from the "NAGS20." [NAGS20 Features] - Capable of handling a minimum of 8 ml - Suitable for high-concentration and high-viscosity samples - Achieves high-pressure processing of 200 MPa in an electric tabletop model - Extremely low contamination suitable for high-purity samples - Compatible with organic solvents (most organic solvents such as acetone, toluene, and NMP can be used) *For more details, please refer to the PDF document or feel free to contact us.

• Homogenizer

Make it into a slurry and perform dispersion.

A "slurry" mixed with powder, solvent, and a dispersant to prevent re-agglomeration is injected into the sample tank. A pressure of up to 250 MPa is applied to the material within the device, and the materials are made to collide head-on using our unique "H-type nozzle" to achieve dispersion. We refer to passing the sample through the device once as a "pass." By repeating this "pass" multiple times, the materials are dispersed to sizes ranging from "microns to several tens of nanometers," and in a "uniform" manner.

• Powder Molding Machine

Take your materials research a step further! Essential items for materials science laboratories. Please download!

The Choko Wet Nano Dispersion Machine Ultra High Pressure Homogenizer NAGS Series is a highly versatile device capable of processing a variety of materials, including ceramics, metals, high aspect ratio materials such as CNTs and CNFs, and emulsions. **Features of the Benchtop Experimental Machine NAGS20** - Exhibits damage-free and strong dispersion power with a uniquely developed H-type nozzle - Capable of handling a minimum of 20ml - Suitable for high concentration and high viscosity samples - Achieves high-pressure processing up to 200MPa in a compact electric benchtop model - Provides contamination-free processing suitable for high purity samples - Compatible with organic solvents (most organic solvents, including acetone, toluene, and NMP, can be used) The pilot machine NAGS100, the medium-scale production machine NAGS200, and the large-scale production machine NAGS1000 are also equipped with the versatile H-type nozzle, making it easy to scale up from the NAGS20. Additionally, we offer contract testing services to assist your company in developing high-performance materials. Please feel free to consult with us. Detailed information is available in PDF and video formats through the related links. Do not hesitate to contact us.

• Fine grinding machine

Mass processing of 500 liters per hour! Ultra-high pressure homogenizer for micronizing slurry samples.

We perform dispersion, emulsification, and disintegration under high pressure. Equipped with our uniquely developed H-type nozzle, the sample pressurized by a high-pressure pump passes through the H-type nozzle, allowing for efficient dispersion, emulsification, and disintegration of uniform fine particles.

• Mixer/agitator

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)