Bostik announces the latest engineering adhesive in Asia, UV-curable gasket AU588.

Bostik, a specialized adhesive company expanding into the global market (www.bostik.com), announces its latest innovations in engineering adhesives. This is part of the company's goal to create smart solutions for Industry 4.0 in Asia.
In response to the demands of modern industry, the newly developed AU588 gasket solution replaces traditional gaskets and accommodates the automation of manufacturing processes. This is the latest product in Bostik's renowned Bostik Born2Bond portfolio, which features a wide range of high-durability UV-curable Cure-In-Place Gasket (CIPG) products.
Bostik offers value propositions that align with industry trends, including high efficiency, automation processes, complex designs, miniaturization, lightweighting, waste reduction, and waterproofing/dustproofing.
The AU588 can be applied to industrial electronic devices and factory automation components, such as advanced driver-assistance systems (ADAS) and electronic control units (ECUs).
For more details, please visit the product page.

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