[Data] WTI Blog Evaluation and Experiment Section Fiscal Year 2020

"Evaluation and analysis methods for BGA packages" and other know-how of our technology are packed full!

This document summarizes the WTI blog of Wave Technology Co., Ltd., a "development and design promotion business" that addresses the shortage of engineers for the fiscal year 2020, focusing on evaluation and experimentation. It includes topics such as "Evaluation with Curve Tracers," "Evaluation and Testing Items for Switching Power Supplies," and "How to Continue Using PC98." Please take a moment to read it. [Contents (excerpt)] ■2020.4.14 Reliability Testing - Ensuring Safety Under Various Conditions ■2020.10.23 Evaluation of Power Conditioners - Various tests including JET certification, conversion efficiency verification, rated testing, lightning surge, etc. ■2020.10.26 Evaluation with Curve Tracers - Is Manual Operation Troublesome? Then Automate It! ■2020.10.27 USB and Compliance Testing ■2020.11.5 Required Functions for Power Conditioners (Part 1) *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Evaluation Board

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

■ FaceMe Security "Visitor Access Management" Main Features and Characteristics < Set Access Period for Each Visitor > - Individual settings for the dates and times visitors can enter - Access periods can be optimized according to the visitor's situation, whether for short visits or long stays. < Two Types of Authentication Methods to Accommodate Various Scenarios > ▶ Authentication via IP Camera - Enables authentication from a distance, achieving facial recognition without the need to disembark. ▶ Authentication via Facial Recognition Device (tablets, etc.) - Ideal for entry scenes such as reception or security posts. Can be flexibly utilized depending on the installation location and operation. - Allows for on-the-spot registration of facial information using the device, enabling smooth responses to sudden visits or unexpected guests. < Real-Time Notifications Supporting Security and Reception Operations > - Real-time notifications of visitor and employee classifications, authorization expiration, and authentication status. - Prevents delays and oversights in verification, balancing the reduction of security staff workload with enhanced security. These features resolve issues arising from visual checks, logbooks, and IC card operations, simultaneously achieving enhanced security and improved efficiency in reception and security operations.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.