Solving the AIoT Puzzle - Innodisk Integrates Subsidiaries to Provide All-Round Services

Enhance security with a smartly connected security system that can be operated from anywhere.

For more details, please refer to the PDF document or feel free to contact us. The security system continues to evolve thanks to the contributions of innovative artificial intelligence (AI) and AIoT solutions. By using AIoT solutions, it becomes possible to implement AI-based facial recognition technology and analyze other biometric data. Furthermore, such solutions reduce the need for on-site management and maintenance work, providing operators with more timely and practical security.

• Memory
• SSD
• Software (middle, driver, security, etc.)

Significantly improve convenience and customer safety, and strengthen mass transportation.

For more details, please refer to the PDF document or feel free to contact us. There is still much room for improvement in public transportation. By using artificial intelligence and Internet of Things (AIoT) technology, the current frustration factors in public transportation can be eliminated, enhancing efficiency and service quality. AIoT technology in public transportation has the potential to greatly contribute to overall quality. For example, buses and subway trains can operate more efficiently and smartly by having AIoT devices analyze demand, traffic flow, and other factors. The quality of onboard services can also be significantly improved by implementing security enhancements and reducing the risk of overcrowding.

• Memory
• SSD
• Software (middle, driver, security, etc.)

Walking the path to a better future using smart and connected technology.

For more details, please refer to the PDF document or feel free to contact us. Road infrastructure is one of the most important infrastructures. The emergence of artificial intelligence and the Internet of Things (AIoT) will undoubtedly bring about the greatest change. Since roads are prevalent in almost every place where human activities exist, road infrastructure can serve as a major backbone for future smart city services. For example, road infrastructure such as streetlights can add wireless connectivity to neighborhoods, provide insights on weather and pollution conditions, and serve as an ideal location for enhancing security by detecting and predicting accidents and crimes.

• Memory
• SSD
• Software (middle, driver, security, etc.)

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)