Height Inspection Device 【Automatic Measurement of ICs and Automatic Discharge of Defective Products】 - Production Achievements Introduction -

Automatically ejects NG products after measurement! A device that measures the height of ICs in automatically loaded JEDEC trays.

The "Integrated Circuit Height Measurement Inspection Device Type 2" is a product capable of measuring heights within 0.7mm in a field of view of 10mm. It loads lead frames (maximum size 30×50) stored in a slot magazine one by one onto the measurement stage to perform height measurements. It ejects defective items based on inspection results and automatically fills good products into empty pockets. Our company offers a comprehensive service from the development and design of FA equipment to assembly adjustments, installation, and maintenance or improvement proposals after delivery! The devices shown are examples of our production achievements. Please feel free to contact us as we can accommodate similar devices or new productions based on this reference.

• Other semiconductor manufacturing equipment

A device for measuring the height of ICs loaded in a lead frame, either automatically or manually!

The "Integrated Circuit Height Measurement Inspection Device Type 1" is a product that can accommodate both automatic measurement control from automatic loading and manual measurement with a single workpiece set manually. It is an inspection device that loads lead frames stored in a slot magazine one by one onto the measurement stage and performs 3D height measurement. The device shown is a reference model. We can accommodate the creation of similar products or entirely new devices, so please feel free to contact us. 【Simple Specifications】 ■ Measurement possible within a viewing angle of 10mm and a height of 0.7mm ■ Maximum 99 registered recipes ■ Minimum movement resolution of 1μ for X and Y axes ■ Maximum X-axis stroke of 300mm and maximum Y-axis stroke of 100mm *For more details, please refer to the PDF materials or feel free to contact us.

• Transistor
• Other measurement, recording and measuring instruments

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

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