We have released a white paper on approaches to implementing image AI and edge AI in harsh environments.

Deploying image AI in harsh environments on PCs equipped with Hailo and NVIDIA AI modules.

The AT-IPCFG series from Analog Tech deploys image AI and edge AI for harsh environments where computers struggle, such as safety management at construction, agriculture, and surveying sites, inspection sites for roads, tunnels, and bridges, vehicles like unmanned transport vehicles, and environments with high temperatures, low temperatures, high humidity, and dust. Equipped with a ruggedized housing that enhances environmental performance, it includes AI chips and AI modules for inference. It provides low-latency, high-speed image AI processing on edge devices, including high-resolution image processing, video processing from multiple cameras, real-time image processing, and AI inference processing. Custom solutions and OEM supply tailored to customer applications are available, so please feel free to consult with us.

• Image Processing Equipment

Are you struggling with implementing AI in your environment? We solve the challenges of AI implementation in harsh conditions for devices with AI chips suitable for industrial applications.

■What is an AI Chip■ An AI chip is a semiconductor designed to accelerate AI computational processing. In image processing and AI tasks, GPUs are becoming almost standardized for training purposes. However, the specifications differ between training and inference, and inference can be achieved using not only GPUs but also FPGAs and ASICs. In particular, inference for edge applications is implemented in devices that process AI on-site alongside IoT, necessitating considerations for adoption based on not only "computational performance" but also "low power consumption," "wide operating temperature," and "long supply duration" for embedded implementations in devices. ■Introduction of AI Chips Suitable for Industrial Applications■ Hailo's AI chip boasting low power consumption and high inference processing capability: 'Hailo-8 AI Processor' The Hailo-8 processor is a chip specifically developed by Hailo for AI processing. Among AI chips, it has the following features that make it particularly suitable for industrial applications: (Feature 1) AI processing with high power efficiency! Power efficiency of 3 TOPS/W (Feature 2) High environmental durability! Operating temperature range of -40°C to 85°C (Feature 3) Planned for long-term supply! Expected supply duration of up to 10 years for the chip alone.

• Dedicated IC
• Expansion Boards
• Embedded Board Computers

Are you struggling with the implementation environment for AI? We solve the challenges of AI implementation in harsh environments with industrial PCs equipped with industrial AI chips that are built to withstand tough conditions.

■Challenges of Implementing Image AI and Edge AI■ Recently, the development of various image AI and edge AI applications has progressed, moving into the device implementation phase. In this phase, unlike in offices or data centers, devices are required to have stringent environmental durability, which presents a challenge for the implementation of edge AI. On the other hand, the data processed at the edge continues to increase in volume and real-time demands, leading to a linear rise in component performance, resulting in extreme heat generation from CPUs, GPUs, and AI chips, which adds to the challenges of device implementation. In edge AI, to enhance processing performance, it is crucial to address heat dissipation from high-heat-generating components such as GPUs and AI chips while ensuring extremely strict environmental durability. This involves temperature control, vibration mitigation, and mechanical design, which are important factors for implementing image AI and edge AI applications in various settings. ■High Environmental Durability Edge AI Platform■ Analog Devices provides a platform for implementing AI in harsh field environments such as 'high temperature/low temperature, water, high humidity, and dust' by equipping industrial PCs with AI chips that excel in environmental durability.

• Industrial PCs
• Embedded Board Computers
• server

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)