[Product Introduction] High-frequency device compatible double-sided wiring process formation technology using transparent substrate.

[In Development] This is a manufacturing method that reduces materials, processes, energy, and waste in conventional construction methods, contributing to environmental protection through decarbonization.

In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.

• High frequency/microwave parts
• Printed Circuit Board
• Other electronic parts

We exhibited a booth at the "4th Annual Meeting of the Japanese Society for Antibody Research" held at Omiya Sonic City from December 1 (Monday) to December 3 (Wednesday). Thank you very much to everyone who visited our booth during the event. Thanks to your support, we were able to successfully conclude the meeting. If you have any questions regarding the products you viewed, please feel free to reach out to us. We will respond to inquiries received during the event in due course. We appreciate your continued support of Higuchi Shokai. ▼Exhibited Products - Various assembly parts (bags, bottles, sampling, etc.) - Depth filters (post-culture filtration)

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Do you have any concerns or requests regarding wired bed exit sensors? × Tangling and tripping of wired cables × Cable disconnection or damage × Worry about forgetting to turn on the switch after temporarily stopping the sensor. × Want to be notified of bed exit even from a location away from the nurse call outlet. Such concerns can be resolved simply by connecting to a wireless set linked to the nurse call system! Our nurse call linked wireless set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed, alleviating concerns about tripping and falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations away from the nurse call outlet, allowing for more flexible equipment placement.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.