High-frequency device-compatible double-sided wiring process formation technology using transparent substrates.
[In Development] This is a manufacturing method that reduces materials, processes, energy, and waste in conventional construction methods, contributing to environmental protection through decarbonization.
In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.
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basic information
Conventional film substrates use colored materials such as polyimide film or liquid crystal polymer film, and the conductors are processed by etching from specialized materials that have roughened copper foil bonded to improve adhesion. Even if the substrate is replaced with COP film using this method, transmission loss cannot be minimized. We aim for mass production using a full additive method that employs photolithography and plating, rather than the method of bonding copper foil and etching. In adopting this construction method, we use a primer that mixes and disperses a catalyst for electroless plating in a colorless transparent binder resin to grow the plating on COP, and the plating resist utilizes a colorless transparent photosensitive type.
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【Applications】 ■Sensor sheet ■Antenna substrate ■Coaxial cable etc.
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.