寺田 Product Lineup

In the robotics industry, high durability that can withstand harsh environments is required. In particular, protecting components and ensuring reliability in areas exposed to shocks, vibrations, and temperature changes is crucial. Inappropriate material selection can lead to robot failures or performance degradation. The TE-7820FR3 achieves both high strength and heat resistance, contributing to the longevity of robots. 【Application Scenarios】 - Joint parts - Drive parts - Sensor parts 【Benefits of Implementation】 - Ensuring high reliability - Extending lifespan - Reducing maintenance costs

• Other polymer materials

In the home appliance industry, the safety and reliability of products are of utmost importance. Especially for products used in high-temperature environments, flame-retardant materials are essential. In the event of a fire, it is necessary to prevent the spread of flames and protect consumer safety. The TE-7820FR3 is equipped with flame retardancy equivalent to UL94 V-0, enhancing the safety of home appliances. 【Application Scenarios】 - Power units - Motors - Heaters 【Benefits of Implementation】 - Improved safety due to high flame retardancy - Increased product reliability - Enhanced customer satisfaction

• Other polymer materials

In the semiconductor industry, particularly in fields that require high reliability, the performance of encapsulation materials for power devices is crucial. To withstand temperature changes and vibrations, and to ensure long-term reliability, excellent heat resistance, flame retardancy, and high adhesion to substrates are essential. TE-7820FR3 has been developed to address these challenges and enhance the performance and reliability of power devices. 【Application Scenarios】 - Power modules - Semiconductor packages 【Benefits of Implementation】 - Improved thermal, electrical, and mechanical performance - Assurance of long-term product reliability

• Other polymer materials

In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion

• Other polymer materials

In the telecommunications industry, stable operation over a long period is required. Particularly for electronic components that are susceptible to temperature changes and external influences, heat dissipation measures and high insulation properties are essential. The TE-7814V addresses these challenges and contributes to the reliability improvement of communication equipment. 【Application Scenarios】 - Base stations - Servers - Communication modules 【Benefits of Implementation】 - Extended lifespan of components due to improved heat dissipation - Realization of stable operation through high insulation properties - Reduction of equipment downtime

• Other polymer materials

In the robot precision equipment industry, high operational accuracy and long lifespan are required. In particular, precise electronic components face the risk of performance degradation and failure due to heat generation. The TE-7814V addresses these issues with its high thermal conductivity, enhancing the reliability of the equipment. 【Application Scenarios】 - Electronic circuit boards for precision robots - Sensor modules - Actuators 【Benefits of Implementation】 - Suppression of malfunction due to thermal runaway - Extension of equipment lifespan - Achievement of stable operation

• Other polymer materials

In the home appliance industry, long-term reliability of products is required, and protecting electronic components, especially those exposed to heat and vibration, is crucial. The TE-7814V addresses these challenges with its high thermal conductivity and high Tg, contributing to the durability of home appliances. 【Usage Scenarios】 - Heat dissipation measures for electronic components prone to heating, such as motors and coils - Protection of electronic devices used in high-temperature environments - Extending the lifespan of products 【Effects of Implementation】 - Suppression of component degradation due to heat - Reduction of product failure risks - Improvement of long-term product reliability

• Other polymer materials

In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes

• Other polymer materials

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

• Other polymer materials

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

• Other polymer materials

In the robotics industry, the reliability of electronic components is crucial for high-precision operation and longevity. In particular, temperature management of components that generate heat, such as motors and sensors, is a key factor that influences the performance of robots. Deterioration of components due to heat can lead to malfunctions and failures, potentially reducing the overall operational rate of the robot. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, protecting the electronic components inside the robot from heat. [Usage Scenarios] - Motors of precision robots - Heat dissipation measures for sensors - Insulation sealing for high-density mounted circuit boards [Effects of Implementation] - Extended lifespan of components - Stable operation of robots - Reduction in maintenance costs

• Resin container

In the telecommunications industry, with the spread of high-speed communication such as 5G, the densification and high performance of communication devices are progressing. Consequently, the amount of heat generated inside the devices is increasing, making thermal management an important issue. Without appropriate thermal measures, there is a risk of performance degradation or failure of the devices. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to the reliability of communication equipment. 【Usage Scenarios】 * Base stations * Servers * Routers * Optical fiber communication devices 【Benefits of Implementation】 * Prolonged device lifespan * Stabilization of performance * Reduced risk of failure

• Resin container

In the home appliance industry, long-term reliability and safety of products are required. Particularly for appliances exposed to temperature changes and vibrations, the protection of internal components and heat dissipation measures are crucial factors that influence the durability of the product. Inadequate heat dissipation can lead to component failure or performance degradation, potentially shortening the product's lifespan. The TE-7901K achieves a balance of high thermal conductivity and insulation, contributing to the durability of home appliances. 【Application Scenarios】 - Motors - Power devices - Coils 【Benefits of Implementation】 - Extended product lifespan due to improved heat dissipation - Enhanced safety through flame retardancy equivalent to UL94 V-0 - Improved workability due to one-component formulation

• Resin container

In the semiconductor industry, high-density packaging is advancing, and as a result, the amount of heat generated is also increasing. Heat can cause performance degradation and failure of semiconductor devices, making effective thermal management essential. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to heat dissipation measures for high-density packaging substrates. Its one-component nature ensures excellent workability and provides stable quality. 【Usage Scenarios】 - Sealing of high-density packaged semiconductor devices - Heat dissipation measures for power devices - Insulation and heat dissipation for motors and coils 【Benefits of Implementation】 - Prolonged device lifespan - Improved product reliability - Increased manufacturing process efficiency

• Resin container

In the electronics industry, thermal management is crucial to ensure the long-term reliability of products. Particularly for electronic components used in high-temperature environments or under heavy loads, heat dissipation performance becomes a key factor that influences product lifespan. If appropriate heat dissipation measures are not implemented, overheating of components can lead to performance degradation or failure, potentially compromising the overall reliability of the product. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, contributing to the improvement of electronic device reliability. 【Application Scenarios】 - Sealing of electronic components that generate heat, such as motors, coils, and power devices - Electronic devices used in high-temperature environments - Electronic devices where reliability is essential 【Benefits of Implementation】 - Suppression of component overheating, extending product lifespan - Improvement of product reliability - Assurance of stable quality

• Resin container

In the automotive industry, reducing the weight of components has become a crucial challenge to achieve both improved fuel efficiency and safety. At the same time, with the proliferation of electric vehicles (EVs) and hybrid electric vehicles (HEVs), heat dissipation measures for motors and power devices are also essential. TE-7901K contributes to addressing these challenges with its lightweight design and high thermal conductivity for effective heat dissipation. 【Application Scenarios】 - Sealing of electronic components such as motors, inverters, and ECUs - Heat dissipation measures for onboard electronic devices 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction of components - Enhanced reliability of electronic components due to high thermal conductivity - Improved workability due to its single-component nature

• Resin container

In the electronics industry, as products become smaller and more high-performance, achieving both insulation and heat dissipation has become an important challenge. In particular, electronic components with high-density mounting tend to generate heat, and insulation failure can lead to product malfunctions. TE-6430 achieves both high thermal conductivity and excellent insulation, contributing to the reliability of electronic devices. 【Usage Scenarios】 - Insulation and heat dissipation measures for motors, coils, and sensors - Protection and insulation of electronic components - Component mounting on circuit boards 【Benefits of Implementation】 - Increased longevity of electronic devices - Improved product reliability - Enhanced design flexibility

• Other polymer materials

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. This is particularly important in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, where the performance of adhesives is critical. Improper adhesion can lead to component detachment or malfunction, potentially resulting in serious accidents. TE-6430, with its high thermal conductivity and flame retardancy, contributes to enhancing safety and reliability in the adhesion of automotive parts. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - Improved heat dissipation due to high thermal conductivity - Enhanced safety due to flame retardancy - Improved workability due to low viscosity

• Other polymer materials

In the industrial robot industry, temperature management of electronic components is crucial for achieving high-precision movements. Particularly for components that generate significant heat, such as high-output motors and control boards, efficient heat dissipation is required. Poor heat dissipation performance can lead to component failure or performance degradation, potentially resulting in a decrease in the overall precision of the robot. TE-7127 addresses these challenges with its high thermal conductivity, contributing to the reliability of industrial robots. 【Application Scenarios】 - Heat dissipation for high-output motors - Sealing of control boards - Protection of precision sensors 【Benefits of Implementation】 - Extended lifespan of components - Improved operational stability of robots - Achievement of high-precision tasks

• Other polymer materials
• Other consumables

In the automotive industry, as the miniaturization and high performance of electronic components progress, thermal management has become an important issue. In particular, for heat-generating components such as engine control units (ECUs) and power semiconductors, efficient cooling is essential. If appropriate thermal measures are not implemented, it can lead to component failure or performance degradation, potentially compromising the reliability and safety of the vehicle. TE-7127 balances high thermal conductivity and ease of use, contributing to the improvement of automotive cooling performance. 【Usage Scenarios】 - Sealing of ECUs - Heat dissipation of power semiconductors - Thermal management of in-vehicle electronic devices 【Benefits of Implementation】 - Extended lifespan of electronic components - Improved reliability of vehicles - Enhanced cooling efficiency

• Other polymer materials
• Other consumables

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially compromising product reliability. TE-7127 achieves both high thermal conductivity and excellent insulation, contributing to improved heat dissipation performance of semiconductor devices and enhancing product reliability. 【Application Scenarios】 - High-performance processors such as CPUs and GPUs - Power semiconductor devices - LED lighting 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Stabilization of performance

• Other polymer materials
• Other consumables

In the robotics industry, the increase in output power has led to a higher risk of performance degradation and failures due to heat generation. In particular, heat dissipation measures for motors and drive components are critical issues that affect the reliability and lifespan of robots. The TE-7900 addresses these challenges with its high thermal conductivity and low viscosity. 【Application Scenarios】 - Insulation and heat dissipation sealing for high-output motors - Heat dissipation measures for power electronics components - Thermal management for robotic arms and drive units 【Benefits of Implementation】 - Suppression of component overheating and stabilization of performance - Extension of product lifespan - Improvement of robot system reliability

• Other polymer materials
• Other consumables

In the power electronics industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. In particular, improving power conversion efficiency directly contributes to enhancing system reliability and energy saving. Without appropriate heat dissipation design, the risk of performance degradation and failure due to overheating of devices increases. TE-7900 enhances heat dissipation and supports the efficient operation of power electronics equipment due to its high thermal conductivity and low viscosity. 【Application Scenarios】 - Inverters - Converters - Power units - Industrial motors 【Benefits of Implementation】 - Extended device lifespan - Improved system reliability - Achievement of energy savings

• Other polymer materials
• Other consumables

In the automotive industry, as the miniaturization and high performance of electronic devices progress, heat dissipation measures have become an important issue. In particular, electronic components such as Engine Control Units (ECUs) and power semiconductors require reliability under high-temperature conditions. TE-7900 achieves both high thermal conductivity and low viscosity, addressing these challenges. This enhances the heat dissipation of electronic components and contributes to the longevity and performance maintenance of products. 【Application Scenarios】 - ECU (Engine Control Unit) - Power Semiconductors - Onboard Motors 【Benefits of Implementation】 - Improved heat dissipation of electronic components - Enhanced product reliability - Extended product lifespan - Support for miniaturization and high performance

• Other polymer materials
• Other consumables

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. The rise in heat generation can lead to performance degradation and a shorter lifespan of devices, making it necessary to efficiently dissipate heat. TE-7900 enhances the heat dissipation of semiconductor devices due to its high thermal conductivity, contributing to improved reliability. 【Usage Scenarios】 - Heat dissipation insulation sealing for CPUs, GPUs, power semiconductors, etc. - Heat dissipation for high-power LEDs - Potting for various electronic components 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Assurance of high reliability

• Other polymer materials
• Other consumables

In the telecommunications industry, adhesive tape for marking purposes is required for product quality control and efficient process management. In particular, it is important to ensure long-term visibility and usability in high-temperature environments. The use of inappropriate tape can lead to peeling of markings and reduced visibility, potentially resulting in decreased work efficiency and quality issues. Our polyester adhesive tape YT-152GC is highly heat-resistant and is ideal for marking applications in the manufacturing process of communication equipment. 【Usage Scenarios】 - Marking of electronic components - Marking of component placement on circuit boards - Identification of cables 【Benefits of Implementation】 - Maintains visibility of markings even in high-temperature environments - Improves work efficiency - Strengthens quality control

• Other consumables
• Adhesive tape
• Other electronic parts

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. In particular, lightweight materials with high heat resistance and adhesive performance are required for component fixation and masking in high-temperature environments. The use of inappropriate tape can lead to peeling and performance degradation, potentially compromising safety. Our polyester adhesive tape YT-152GC utilizes a lightweight polyester substrate and silicone-based adhesive, achieving heat resistance up to 180°C. It balances weight reduction with high reliability, contributing to solving challenges in aerospace applications. 【Usage Scenarios】 * Masking of aircraft components * Component fixation in high-temperature environments * Splicing applications 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Increased reliability due to high heat resistance * Streamlined masking processes

• Other consumables
• Adhesive tape
• Other electronic parts

In the electronics industry, as products become smaller and more high-performance, ensuring insulation performance is crucial. In high-temperature environments and when arranging components in tight spaces, insulation failures can lead to product malfunctions or performance degradation. Our polyester adhesive tape YT-152GC has a heat resistance of 180°C, making it ideal for insulation applications in electronic devices. [Usage Scenarios] - Masking of electronic components - Protection of printed circuit boards - Insulation in high-temperature environments [Benefits of Implementation] - Improved product reliability due to high insulation performance - Versatility for a wide range of applications due to heat resistance - Enhanced work efficiency

• Other consumables
• Adhesive tape
• Other electronic parts

In the automotive industry, there is a demand for improved cooling performance due to the increased performance of electronic devices. Particularly for components that tend to generate heat, such as engine control units and motors, effective heat dissipation measures are essential. If proper cooling is not implemented, it may lead to component failure or performance degradation. TE-7163 features high thermal conductivity, rapid curing, and low viscosity, contributing to the reliability of automotive cooling systems. 【Application Scenarios】 - Industrial motors - Coils - Capacitors 【Benefits of Implementation】 - Efficient heat dissipation due to high thermal conductivity - Increased productivity due to rapid curing - Improved workability due to low viscosity

• Other polymer materials
• Other consumables

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially shortening product lifespan. TE-7163 efficiently dissipates heat generated by semiconductor devices to the outside due to its high thermal conductivity, thereby improving device reliability. 【Application Scenarios】 - Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors. 【Benefits of Implementation】 - Prolonged device lifespan - Enhanced product reliability - Stable performance maintenance

• Other polymer materials
• Other consumables

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly for body and electronic parts exposed to vibrations and temperature changes, the performance of adhesives significantly affects the product's lifespan. Improper adhesion can lead to component detachment or malfunction. TERADITE TE-7172K4 offers high adhesion, flexibility, and flame resistance, contributing to the reliability of automotive parts. 【Application Scenarios】 - Adhesion of body parts - Fixing of electronic components - Adhesion of parts requiring heat dissipation measures 【Benefits of Implementation】 - Improved reliability of components due to high adhesion strength - Enhanced safety due to flame resistance - Improved heat dissipation due to increased thermal conductivity

• Other consumables
• Other polymer materials

"TERADITE TE-7172K4" is a two-component, room temperature curing epoxy resin. It has a high thermal conductivity resin (3W/m·K) and is flame retardant equivalent to UL94 3mm V-2. It is a flexible resin that improves upon the flexibility of TE-7172K3. It can be used as an insulating material for heat dissipation in electronic and electrical devices where stress relaxation is required, as well as for gap fillers. 【Cured Material Properties (Partial)】 ■Appearance (Visual): Gray solid ■Specific Gravity (25°C): 3.06 ■Curing Shrinkage Rate (25°C): 0.2% ■Hardness (25°C): 20 Shore D (70 Shore A) ■Glass Transition Temperature (Cooling): -48°C *For more details, please download the PDF or feel free to contact us.

• Other consumables
• Other polymer materials

"TERADITE TRU-0260K3" is a one-component UV-curable epoxy resin. It is a high heat-resistant and high humidity-resistant resin, designed to prevent dripping. Additionally, it is a high-density resin with a specific gravity of 5.0. It can be used as a resin for balancers in small motors (thickness of 2mm or less). 【Liquid Properties】 ■ Component: Acrylate resin ■ Appearance (visual): Gray liquid ■ Specific gravity (25°C): 5.0 ■ Viscosity (25°C, 10rpm): 45,000 mPa·s ■ Thixotropic index (1rpm/10rpm): 1.2 *For more details, please download the PDF or feel free to contact us.

• Other consumables
• Other polymer materials

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

• Other polymer materials
• Other electronic parts

Conventional transparent epoxy required time and heat for the curing process, but TRU-0222K cures instantly with LED light (1,500mJ/cm²). It uses a light initiator that suppresses yellowing, achieving both high transparency and a hard finish. With low viscosity and excellent workability, it demonstrates high performance in a wide range of applications, including CFRP, resin molded products, craft works, and protection of electronic components. Additionally, its high Tg of 124°C allows it to be used in environments where heat resistance is required. *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"TRU-0260K2" is a one-component UV-curable epoxy resin developed for use in small motor balancers. It can be cured in a short time under UV irradiation (3,000 mJ/cm²) from a metal halide lamp, making it suitable for efficient mass production processes. This product possesses high heat resistance and high humidity resistance, ensuring long-term reliability even in harsh environments. Additionally, its high thixotropy (thixotropic index of 1.6) enhances separation prevention performance, allowing for stable application and molding. The cured material features a high specific gravity design of 2.8, stabilizing balance performance, along with excellent physical properties such as Shore D hardness of 90, glass transition temperature of 128°C, and linear expansion coefficient of 23 ppm/K. Furthermore, it has a low curing shrinkage rate of 0.7%, making it suitable for parts that require precision. 【Features】 - One-component UV-curable epoxy resin - High specific gravity (2.8) with stable balance performance, ideal for small motor balancer applications - High heat resistance (Tg 128°C) and high humidity design *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TRU-0153K" is a one-component UV-curable urethane acrylate resin developed for the coating of electronic components. It can be cured in a short time using metal halide lamp irradiation (1,500 mJ/cm²), demonstrating high productivity even in mass production processes. This product has a low viscosity of 1,300 mPa·s and low hardness (Shore A35), providing flexible properties that relieve stress and prevent crack formation. Furthermore, it shows no change in hardness even after high-temperature testing at 150°C for 1,000 hours and 1,000 cycles of thermal cycling between -40°C and 150°C, exhibiting excellent moisture and heat resistance and durability. It balances high insulation and flexibility. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Short curing time (UV: 1,500 mJ/cm²) ■ Low viscosity and low hardness (Shore A35) with flexibility, effective for stress relief ■ No change in hardness after 150°C for 1,000 hours and -40°C to 150°C for 1,000 cycles *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

• Other polymer materials

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

TE-5018 is a one-component, heat-curing epoxy resin developed for bonding and insulating encapsulation applications of electronic and electrical components. While ensuring stability with refrigerated storage, it accommodates low-temperature curing at 80°C for 1 hour, making it suitable for heat-sensitive components and processes with temperature constraints. The cured material exhibits high mechanical strength with a bending strength of 95 MPa, a bending modulus of 3,300 MPa, and a Shore D hardness of 87. Additionally, it possesses excellent electrical properties with an insulation breakdown strength of 20 kV/mm and a volume resistivity of 5×10^15 Ω·cm, supporting the long-term reliability of electronic devices. Furthermore, it has balanced physical properties with a linear expansion coefficient of 61 ppm/K, a curing shrinkage rate of 2.5%, and a water absorption rate of 0.3%, reducing the risk of cracks and performance degradation. It also excels in workability and can be widely used for insulating encapsulation of electronic components, structural bonding, and ensuring reliability in heat and humidity-resistant environments. 【Features】 ■ One-component heat-curing epoxy resin (no mixing required) *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please inquire if needed.

• Other polymer materials

"TE-6408FRK" is a room temperature curing two-component epoxy resin, suitable for coating and adhesive applications. It can cure at 25°C, eliminating the need for heating equipment, allowing for energy-efficient and effective work. A major feature of this product is its flexible cured material. It demonstrates over 90% transparency (420-600nm transmission), making it suitable for applications that require high aesthetic quality. Additionally, it possesses flame retardancy (equivalent to UL94 V-0 at 5mm thickness), contributing to safety assurance. It can be widely used for coating electronic components, bonding plastics and metals, and clear applications that require aesthetic appeal. [Features] - Two-component room temperature curing epoxy resin (mixing ratio 100:30) - Flexible cured material (tensile elongation of 230%, crack prevention effect) - High transparency (over 90% transmission at 420-600nm) - Low viscosity and good workability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if you need them.

• Other polymer materials

The "TE-7170K" is a two-component, room temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It cures at 25°C without the need for heating equipment, making it energy-efficient and easy to handle on-site. This product has a thermal conductivity of 0.9 W/m·K, making it effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb and alleviate stress, helping to suppress the occurrence of cracks in substrates and components. It is suitable for applications that require high reliability. With a low viscosity design of 3,500 mPa·s (25°C), it excels in filling details and provides a sufficient working time of approximately 3 hours. 【Features】 ■ Two-component, room temperature curing epoxy resin (mixing ratio 100:20) ■ Effective for heat dissipation measures with a thermal conductivity of 0.9 W/m·K ■ Flexible design that effectively alleviates stress and prevents cracking ■ Good workability with low viscosity and approximately 3 hours of usable time *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials