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  3. 寺田
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Electronic Components and Semiconductors
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寺田

addressTokyo/Minato-ku/2-3-3 Shiba Koen, Terada Building 2F
phone03-3431-8211
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last updated:Aug 19, 2025
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Epoxy & Acrylic Resin TERADITE Epoxy & Acrylic Resin TERADITE
Araldite Adhesive 2000 Series (TDS and SDS available) Araldite Adhesive 2000 Series (TDS and SDS available)
Araldite Urethane Resin Series (TDS and SDS available) Araldite Urethane Resin Series (TDS and SDS available)
I want to use a resin with high heat release and thermal conductivity. I want to use a resin with high heat release and thermal conductivity.
I want to use a heat-resistant resin. I want to use a heat-resistant resin.
I want to use transparent resin. I want to use transparent resin.
Fluororesin TERAELL Fluororesin TERAELL
Various industrial adhesive tapes and films Various industrial adhesive tapes and films
Release agent Release agent
Acrylic-based adhesive and carbon paste. Acrylic-based adhesive and carbon paste.
Drill and router for printed circuit board processing Drill and router for printed circuit board processing
I

I want to use a heat-resistant resin.

High Heat Resistance Liquid Epoxy Resin Series We are currently offering property tables and test data. Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has increased significantly. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a Tg of up to 229°C. This liquid epoxy resin can also be used in areas outside the electronics field where high heat resistance is required.

High heat-resistant liquid epoxy resin series - offering property tables and test data!

We offer a wide range of liquid epoxy resin encapsulants with a maximum Tg (glass transition temperature) of 308°C under our own brand, TERADITE.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a maximum Tg of 308°C. These liquid epoxy resins can also be used in areas requiring high heat resistance outside the field of electronic devices. Currently, we are providing a specification sheet and thermal test data for some products! For more details, please check the PDF download below. Feel free to contact us with any inquiries.

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High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

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[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

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