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  3. 寺田
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寺田

addressTokyo/Minato-ku/2-3-3 Shiba Koen, Terada Building 2F
phone03-3431-8211
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last updated:Aug 19, 2025
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Epoxy & Acrylic Resin TERADITE Epoxy & Acrylic Resin TERADITE
Araldite Adhesive 2000 Series (TDS and SDS available) Araldite Adhesive 2000 Series (TDS and SDS available)
Araldite Urethane Resin Series (TDS and SDS available) Araldite Urethane Resin Series (TDS and SDS available)
I want to use a resin with high heat release and thermal conductivity. I want to use a resin with high heat release and thermal conductivity.
I want to use a heat-resistant resin. I want to use a heat-resistant resin.
I want to use transparent resin. I want to use transparent resin.
Fluororesin TERAELL Fluororesin TERAELL
Various industrial adhesive tapes and films Various industrial adhesive tapes and films
Release agent Release agent
Acrylic-based adhesive and carbon paste. Acrylic-based adhesive and carbon paste.
Drill and router for printed circuit board processing Drill and router for printed circuit board processing
I

I want to use a resin with high heat release and thermal conductivity.

【TERADITE】 High thermal conductivity liquid epoxy resin encapsulant A proposal for high thermal conductivity resin as a solution to the heating and heat dissipation issues of electronic devices that have become a challenge in recent years. A specification sheet is available.

【TERADITE】High thermal conductivity liquid epoxy resin encapsulant

Proposal of high thermal conductivity resin as a solution to the heating and heat dissipation issues of electronic devices that have become a challenge in recent years. Flexible and room temperature curing products are also available. Specification sheets are currently being presented!

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has increased significantly. Our company offers grades of two-component liquid epoxy with thermal conductivity ranging from 1 to 6.5 W/mK. We also have a one-component product with a thermal conductivity of 4 W/mK. *NEW: As of September 6, 2024, we have published the specifications for a new development product with a thermal conductivity of 8.5 W/mK. Currently, we are distributing the specification sheets! For more details, please refer to the PDF download below. Feel free to contact us with any inquiries.

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High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

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Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

Flexible high thermal conductivity (high thermal conductivity) resin with thermal conductivity ranging from 0.9 to 2.8 W/m·K! We have a lineup of four products available for room temperature curing and heat curing!

In recent years, with the miniaturization and high integration of components, there has been a demand for thermally conductive epoxy resins as insulating materials, and stress relief has also become necessary. In response to this need, we have developed a flexible thermal conductive resin series. This product series features low viscosity for ease of use and has thermal conductivity ranging from 0.9 to 2.8 W/m·K. In addition to the conventional heat-curing type, we also offer an environmentally friendly room-temperature curing type. Both types are two-component systems. We also have products that are non-flexible but offer higher thermal conductivity. For more details, please download the PDF "Introduction to TERADITE [Updated on 2024/8/1]" from the link below or check the product page. https://www.ipros.jp/product/detail/2001118658 *For product details, please download the PDF from the link below or feel free to contact us. *On 2024/8/1, the PDF for TE-7172 was replaced with the improved model number TE-7172K. *On 2024/9/24, the PDF for TE-7170 was replaced with the improved model number TE-7170K.

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