寺田 List of Products and Services

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

TE-7900 Two-component heating curing epoxy resin Features: High thermal conductivity (heat dissipation), excellent workability of 3W/mK, low viscosity, environmentally friendly (non-lead, non-halogen), low thermal expansion *The linear expansion coefficient is low at 16, making it less prone to cracking. Applications: Heat dissipation insulation sealing for industrial motors, coils, transformers, capacitors, etc. ■ Thermal conductivity: 3.0 (W/mK) *For more details, please download the PDF from below or feel free to contact us.

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

TE-7105 Two-component heating hardening epoxy resin Features: Acid anhydride curing, short curing time, flame retardant equivalent to UL94 V-0 Applications: Potting for various electronic components ■ Mixing viscosity: 9,500 at 25℃ ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 100℃ for 2 hours *For more details, please download the PDF from the bottom or feel free to contact us.

TE-7159 Two-component heating hardening epoxy resin Features: Cured with anhydride, short curing time, high thermal conductivity (1.0 W/mK), flame retardant equivalent to UL94 V-0. Due to the anhydride curing, it has a long usable time after mixing the two components (approximately 6 to 8 hours). Applications: Potting for various electronic components ■ Thermal conductivity: 1.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 100°C x 2h

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

E-1 Two-component liquid curing epoxy resin Features: Amine curing (can cure at room temperature), low elastic modulus, crack resistance, available in small quantities with short delivery times due to stock availability Applications: Sealing and molding for various electrical and electronic components ■ Recommended curing conditions: 25°C x 24h *Please be cautious when handling E-1 as the hardener is classified as a hazardous substance. *For more details, please download the PDF below or feel free to contact us.

TE-6010 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, non-toxic, non-halogenated, flame retardant equivalent to V-0 Good adhesion to bake boards, environmentally friendly with room temperature curing Applications: Sealing and casting for various electrical and electronic components ■ Mixing viscosity: 2,300 (mPa·s) at 25°C ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 50°C for 10 hours (can also cure at room temperature)

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

■Appearance: Milky white liquid ■Viscosity: 10–20 (mPa.s/25℃) ■Working temperature: 20–25℃ ■Packaging: 1L, 15L *For more details, please download the PDF from the bottom or feel free to contact us.*

TE-8008 2-component mixed epoxy resin Features: Flexibility, thermal conductivity, environmentally friendly, flame retardant equivalent to V-0, Applications: Sealing and molding for electrical and electronic components requiring crack resistance *Heat resistance is approximately 100°C. *For more details, please download the characteristic table PDF from below or feel free to contact us. *For flexible resins of other grades, please refer to the PDF document "Epoxy & Acrylic Resins 'TERADITE'" available below.

TX-2610-2 (Product image in preparation) 1-component epoxy resin Features: General-purpose, heat-curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesive 【Specifications (excerpt)】 ■Viscosity: 12,000 (mPa·s) at 25℃ ■Glass transition temperature: 85℃ ■Shear adhesive strength: 20 (MPa) SUS/SUS at 25℃ ■Recommended curing conditions: 80℃ x 1h

TE-1002 (Product image in preparation) Two-component epoxy resin Features: General-purpose, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 50,300 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 40℃ ■Shear adhesive strength: 23 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

TE-1003 (Product image in preparation) Two-component epoxy resin Features: High adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 97,000 (mPa·s) ■Pot life: 1 hour (25℃) ■Glass transition temperature: 33℃ ■Shear adhesive strength: 237 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

TE-1004 (Product image in preparation) Two-component epoxy resin Features: High plastic adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 12,000 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 10℃ ■Shear adhesive strength: 7.7 (MPa) SUS/SUS 25℃ Substrate failure GL/GL 25℃ 1.8 (MPa) POM/POM ■Recommended curing conditions: 25℃ x 24h

TE-1005 (Product image in preparation) Two-component epoxy resin Features: Fast curing, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 24,000 (mPa·s) at 25℃ ■Pot life: 0.5 hours (at 25℃) ■Glass transition temperature: 45℃ ■Shear adhesive strength: 22 (MPa) SUS/SUS at 25℃ 　　　　　　　　　Substrate failure GL/GL at 25℃ ■Recommended curing conditions: 25℃ x 6h

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has increased significantly. Our company offers grades of two-component liquid epoxy with thermal conductivity ranging from 1 to 6.5 W/mK. We also have a one-component product with a thermal conductivity of 4 W/mK. *NEW: As of September 6, 2024, we have published the specifications for a new development product with a thermal conductivity of 8.5 W/mK. Currently, we are distributing the specification sheets! For more details, please refer to the PDF download below. Feel free to contact us with any inquiries.

Heat-curing phenolic conductive paint. It is a one-component type with recommended curing conditions of 200°C for 2 minutes. While screen printing is recommended for application, brushes and other tools can also be used. *For more details, please refer to the PDF document or feel free to contact us.

This is a list of our company's brand epoxy resin "Teradite" for two-component mixed epoxy resin used for tooling. It is usually in stock, so you can purchase it in small quantities. *Contents of the document* ■ For vacuum, pressure, and RIM molding surface gel coat ■ For heat-resistant laminating and heat-resistant backing ■ For general casting for pattern models and jigs ■ For gel coat for precision inspection jigs ■ For sand backing and laminating (available for summer and winter) ■ Workable resin for master models ■ Release agent (MO-7) For more details, please check the "PDF Download" at the bottom.

The TERADITE adhesive series from Terada Corporation is an adhesive primarily designed for bonding various metals and plastics. It is made to order, but you can purchase it in small quantities (around a few hundred grams). Samples are also available, so if you are interested, please feel free to contact us. Additionally, customization according to customer requirements is possible. If you wish to customize, please do not hesitate to inquire. ■ Single-component heat-curing epoxy adhesive ■ Two-component room temperature-curing epoxy adhesive (Note: TE-6010 is a potting resin, but it has high suitability for bonding bake boards.) ■ Anaerobic curing (polyepoxy methacrylate) adhesive *For more details, please download the PDF document from the bottom or contact us.

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

TE-6410 (Product image coming soon) Two-component epoxy resin Features: Low Tg (flexibility), CFRP, high plastic adhesion Applications: Adhesives, sealants Mixing ratio 100:170 ... Pot life 4 hours Mixing ratio 100:200 ... Pot life 2 hours 【Specifications (excerpt)】 ■ Mixing viscosity: 25℃ 36,000 (mPa·s) ■ Glass transition temperature: -50℃ ■ Shear adhesion strength: 18 (MPa) CFRP/CFRP at 25℃ and others ■ Recommended curing conditions: 25℃ x 36h, 60℃ x 5h

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a maximum Tg of 308°C. These liquid epoxy resins can also be used in areas requiring high heat resistance outside the field of electronic devices. Currently, we are providing a specification sheet and thermal test data for some products! For more details, please check the PDF download below. Feel free to contact us with any inquiries.

This is a highly transparent resin with a transmittance of over 95%. It has excellent weather resistance, is less prone to yellowing, and can be used widely from crafts to electronic components. Due to its high flexibility, it excels in conformity and crack resistance. Additionally, TE-6408BL6 absorbs ultraviolet light in the UV range (approximately below 450nm), making it a resin with low yellowing and high weather resistance. 【Features】 ■ High transparency ■ Room temperature curing two-component epoxy resin (25℃×20h) ■ Flexibility (Shore A 60) ■ High weather resistance 【Applications】 ■ Coatings ■ Adhesives ■ Crafts *For more details, please download the PDF below or feel free to contact us. *Samples are available, so please inquire.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

In recent years, with the miniaturization and high integration of components, there has been a demand for thermally conductive epoxy resins as insulating materials, and stress relief has also become necessary. In response to this need, we have developed a flexible thermal conductive resin series. This product series features low viscosity for ease of use and has thermal conductivity ranging from 0.9 to 2.8 W/m·K. In addition to the conventional heat-curing type, we also offer an environmentally friendly room-temperature curing type. Both types are two-component systems. We also have products that are non-flexible but offer higher thermal conductivity. For more details, please download the PDF "Introduction to TERADITE [Updated on 2024/8/1]" from the link below or check the product page. https://www.ipros.jp/product/detail/2001118658 *For product details, please download the PDF from the link below or feel free to contact us. *On 2024/8/1, the PDF for TE-7172 was replaced with the improved model number TE-7172K. *On 2024/9/24, the PDF for TE-7170 was replaced with the improved model number TE-7170K.

This is a high-performance epoxy and acrylic resin compound that brings together our company's technology, including adhesive technology for high-performance resins, know-how in manufacturing, and unique synthesis techniques for compound design. We respond to diverse needs, not only with conventional epoxy resins but also with a variety of functional products such as high thermal conductivity, high heat resistance, and flexibility, as well as environmentally friendly resins and new UV-curable resins (acrylic-based). 【Features】 ■ Infinite applications for sealing, molding, and bonding of electrical and electronic components ■ Compound design ■ Technology cultivated in the electronic device industry ■ Responding to various needs ■ Customization according to your requests ■ Made-to-order production in small quantities (minimum around 1kg) 【Product Lineup】 ■ High thermal conductivity resin (up to 6.5W/m·K) ■ High heat resistance resin (up to 300℃) ■ General-purpose potting resin ■ Transparent resin ■ Flexible resin ■ Adhesives (one-component heat curing, two-component room temperature curing, anaerobic) ■ UV-curable resin ■ Functional resins (low specific gravity, fast curing, low chlorine, flame retardant) *For more details, please refer to the PDF document or feel free to contact us.

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

TE-1002FR is an epoxy-based adhesive with flame retardancy equivalent to UL94 V-0 (5mm thick). It can be used for bonding, fixing, and sealing in areas where flame retardancy is required. Two-component room temperature curing epoxy resin Features: Room temperature curing, high adhesion strength, flame retardancy *Samples are available upon request. Please contact us for more details. *For more information about this product, please download the specification sheet from below. *For other products, please download the catalog and epoxy & acrylic resin "TERADITE" from below.

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

TE-7172K2 is an epoxy resin with high thermal conductivity (3W/m·K) and flexibility. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical equipment where stress relief is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.