Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.
TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.
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【Lineup】 ■TE-7163 (Equivalent to 2W V-0) ■TE-7900 (Equivalent to 3W V-0) ■TE-7127 (Equivalent to 4W V-0) ■TE-6500 (Equivalent to 3W V-0, low-temperature curing) ■TE-7901 (Equivalent to 4W V-0, single-component)
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【Purpose】 ■ Heat dissipation insulation sealing for electronic components such as motors, coils, transformers, and capacitors.
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Company information
Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.