[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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