寺田 Product Lineup

TERAELL is our high-performance fluoropolymer. Please use it for various coatings, water and oil repellents, and release agents. TRA-1030 is a non-fluorinated water repellent. 【Applications】 ■ Precision release agent ... TRA-311 series (*NEW) ■ Water and oil repellent/anti-fouling coating ... TRA-311 (*NEW), TRA-1030 series (*NEW), TRA-1015 series ■ Conformal coating ... TRA-190411, TRA-310 (formerly TRA-191216) series

• Coating Agent

This is a silicone-based adhesive tape, heat-resistant up to 200°C, and anti-static polyimide adhesive tape. For general-purpose polyimide adhesive tape, please refer to YT-130AH at the link below. ➡YT-130AH: https://www.ipros.jp/product/detail/2000631203 The color is amber. Please check the photo on the left. Use it in situations where anti-static properties are required for various processes. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 6.37 (650) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

Our carbon paste has been loved for many years both domestically and internationally. The resistance values range from 10Ω to 2MΩ and have various features tailored to different applications. Additionally, various customizations are possible according to your requests. For more details, please refer to the PDF below. ■Main Applications - Static electricity prevention, electromagnetic wave shielding - Semi-fixed resistors, variable resistors - Sliding resistors - Contacts - Various sensors - Drone remote controls, etc.

• Other electronic parts
• Resistors
• Printed Circuit Board

The TERADITE adhesive series from Terada Corporation is an adhesive primarily designed for bonding various metals and plastics. It is made to order, but you can purchase it in small quantities (around a few hundred grams). Samples are also available, so if you are interested, please feel free to contact us. Additionally, customization according to customer requirements is possible. If you wish to customize, please do not hesitate to inquire. ■ Single-component heat-curing epoxy adhesive ■ Two-component room temperature-curing epoxy adhesive (Note: TE-6010 is a potting resin, but it has high suitability for bonding bake boards.) ■ Anaerobic curing (polyepoxy methacrylate) adhesive *For more details, please download the PDF document from the bottom or contact us.

• glue
• Other polymer materials
• Other electronic parts

This is a fluorine-based coating agent that does not contain PFOA and related substances and is not classified as a fire hazard. ■ Applications: Electronic substrates, LEDs, etc. ■ Application methods: DIP, dispenser, etc. ■ Drying time: DIP touch dry in 2 minutes, fully dry in 1 hour ■ Solid content concentration can be adjusted according to customer requirements ■ Option to choose the presence or absence of fluorescent agents

• Coating Agent
• Rust Inhibitor
• Printed Circuit Board

This is a list of our company's brand epoxy resin "Teradite" for two-component mixed epoxy resin used for tooling. It is usually in stock, so you can purchase it in small quantities. *Contents of the document* ■ For vacuum, pressure, and RIM molding surface gel coat ■ For heat-resistant laminating and heat-resistant backing ■ For general casting for pattern models and jigs ■ For gel coat for precision inspection jigs ■ For sand backing and laminating (available for summer and winter) ■ Workable resin for master models ■ Release agent (MO-7) For more details, please check the "PDF Download" at the bottom.

• Other polymer materials
• Resin mold
• plastic

Heat-curing phenolic conductive paint. It is a one-component type with recommended curing conditions of 200°C for 2 minutes. While screen printing is recommended for application, brushes and other tools can also be used. *For more details, please refer to the PDF document or feel free to contact us.

• paint
• Other polymer materials
• Other electronic parts

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has increased significantly. Our company offers grades of two-component liquid epoxy with thermal conductivity ranging from 1 to 6.5 W/mK. We also have a one-component product with a thermal conductivity of 4 W/mK. *NEW: As of September 6, 2024, we have published the specifications for a new development product with a thermal conductivity of 8.5 W/mK. Currently, we are distributing the specification sheets! For more details, please refer to the PDF download below. Feel free to contact us with any inquiries.

• Other electronic parts

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

• Other polymer materials
• Other electronic parts

TE-6311K8 2-component low specific gravity epoxy resin Features: Room temperature curing, low specific gravity Applications: Lightweighting of components, etc. 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 2,170 (mPa·s) ■Glass transition temperature: 34℃ ■Cured material specific gravity: 0.78 (water displacement method) ■Mixing ratio R/H: 100/36 ■Curing conditions: 25℃ x 24h (if heated, 40℃ x 12h, 60℃ x 3h)

• Other polymer materials
• Other electronic parts

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

• Other polymer materials
• Other electronic parts

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

• Other polymer materials
• Other electronic parts

It can be used for masking such as plating, as well as for splicing and carrier tape. The adhesive is applied thicker than our general-purpose polyester tape 152G, resulting in slightly higher adhesion. https://www.ipros.jp/product/detail/2000631228 (152G page) The color is green (photo in preparation). 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesion strength N/25mm (gf/25mm): 9.8 (1,000)

• Other consumables
• Adhesive tape
• Other electronic parts

TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TE-1005 (Product image in preparation) Two-component epoxy resin Features: Fast curing, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 24,000 (mPa·s) at 25℃ ■Pot life: 0.5 hours (at 25℃) ■Glass transition temperature: 45℃ ■Shear adhesive strength: 22 (MPa) SUS/SUS at 25℃ 　　　　　　　　　Substrate failure GL/GL at 25℃ ■Recommended curing conditions: 25℃ x 6h

• glue
• Other polymer materials
• Other consumables

TE-1004 (Product image in preparation) Two-component epoxy resin Features: High plastic adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 12,000 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 10℃ ■Shear adhesive strength: 7.7 (MPa) SUS/SUS 25℃ Substrate failure GL/GL 25℃ 1.8 (MPa) POM/POM ■Recommended curing conditions: 25℃ x 24h

• glue

TE-1003 (Product image in preparation) Two-component epoxy resin Features: High adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 97,000 (mPa·s) ■Pot life: 1 hour (25℃) ■Glass transition temperature: 33℃ ■Shear adhesive strength: 237 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

• glue
• Other polymer materials
• Other consumables

TE-1002 (Product image in preparation) Two-component epoxy resin Features: General-purpose, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 50,300 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 40℃ ■Shear adhesive strength: 23 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

• glue

TX-2610-2 (Product image in preparation) 1-component epoxy resin Features: General-purpose, heat-curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesive 【Specifications (excerpt)】 ■Viscosity: 12,000 (mPa·s) at 25℃ ■Glass transition temperature: 85℃ ■Shear adhesive strength: 20 (MPa) SUS/SUS at 25℃ ■Recommended curing conditions: 80℃ x 1h

• glue

CM3F is a standard crepe paper adhesive tape. It can be widely used for masking, temporary fixing, temporary stopping, surface protection, and more. 【Specifications (excerpt)】 ■ Base material type: Crepe paper ■ Adhesive type: Silicone-based ■ Total tape thickness (μm): 170 ■ Base material thickness (μm): 125 ■ Adhesive strength N/25mm (gf/25mm): 6.86 (700) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. The color is red. Please use it as a process tape for various heat-resistant masking and temporary fixing applications. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 60 ■ Adhesive strength N/25mm (gf/25mm): 6.52 (665)

• Adhesive tape
• Other consumables
• Other electronic parts

It can withstand temperatures up to 200℃ and can be used as various masking and heat-resistant process tapes. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 7.84 (800) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

It can withstand temperatures up to 200°C and can be used as various masking and heat-resistant process tapes. The adhesive is thick, with a total thickness of 100μm. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesive strength N/25mm (gf/25mm): 6.86 (700) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

This is a derivative model of the general-purpose polyimide adhesive tape, YT-130AH (➡https://www.ipros.jp/product/detail/2000631203). While maintaining the basic specifications such as adhesive strength, it has been specially processed to make it easier to pull out. The color is amber. Please check the photo on the left. The heat resistance is 200°C. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 6.57 (670) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

At Terada Co., Ltd., we handle the flat pack paper and polyester film composite tape 'CM8R'. Please use it in situations that require heat resistance, such as masking for solder levelers. 【Specifications (excerpt)】 ■ Base material type: Flat pack paper + Polyester ■ Adhesive type: Silicone-based ■ Total tape thickness (μm): 290 ■ Adhesive strength N/25mm (gf/25mm): 8.82 (900) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Printed Circuit Board

This is a double-sided adhesive tape made of thicker polyimide film. It has double the substrate thickness compared to the general-purpose YT-130AH. The color is amber. Please check the photo on the left. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Substrate type: Polyimide ■ Adhesive type: Silicone-based ■ Substrate thickness (μm): 50 ■ Total tape thickness (μm): 90 ■ Adhesive strength N/25mm (gf/25mm): 7.06 (720)

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. It is characterized by being thinner and having weaker adhesion compared to other tapes we handle. The color is brown. (Photo is being prepared.) Please use it as a process tape for various heat-resistant masking and temporary fixing. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 35 ■ Adhesive strength N/25mm (gf/25mm): 5.39 (550)

• Adhesive tape
• Other consumables
• Printed Circuit Board

At Terada Corporation, we handle the polyester adhesive tape 'YT-152G'. It can be used for masking in processes such as plating, as well as for splicing and carrier tape. The color is a bright green. Please check the photo on the left. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 80 ■ Adhesive strength N/25mm (gf/25mm): 8.62 (880)

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of general-purpose polyimide film. For double-sided tape, please refer to the YT-130DJ below. ➡YT-130DJ: https://www.ipros.jp/product/detail/2000607744 The color is amber. Please check the photo on the left. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■Base material type: Polyimide ■Adhesive type: Silicone-based ■Base material thickness (μm): 25 ■Total tape thickness (μm): 65 ■Adhesive strength N/25mm (gf/25mm): 6.57 (670) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.

• High frequency/microwave parts
• Printed Circuit Board
• Other electronic parts

TE-8008 2-component mixed epoxy resin Features: Flexibility, thermal conductivity, environmentally friendly, flame retardant equivalent to V-0, Applications: Sealing and molding for electrical and electronic components requiring crack resistance *Heat resistance is approximately 100°C. *For more details, please download the characteristic table PDF from below or feel free to contact us. *For flexible resins of other grades, please refer to the PDF document "Epoxy & Acrylic Resins 'TERADITE'" available below.

• Other polymer materials
• Other electronic parts

■Appearance: Milky white liquid ■Viscosity: 10–20 (mPa.s/25℃) ■Working temperature: 20–25℃ ■Packaging: 1L, 15L *For more details, please download the PDF from the bottom or feel free to contact us.*

• Other polymer materials

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

• Other polymer materials
• Other consumables

TE-6010 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, non-toxic, non-halogenated, flame retardant equivalent to V-0 Good adhesion to bake boards, environmentally friendly with room temperature curing Applications: Sealing and casting for various electrical and electronic components ■ Mixing viscosity: 2,300 (mPa·s) at 25°C ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 50°C for 10 hours (can also cure at room temperature)

• Other polymer materials
• Other consumables

E-1 Two-component liquid curing epoxy resin Features: Amine curing (can cure at room temperature), low elastic modulus, crack resistance, available in small quantities with short delivery times due to stock availability Applications: Sealing and molding for various electrical and electronic components ■ Recommended curing conditions: 25°C x 24h *Please be cautious when handling E-1 as the hardener is classified as a hazardous substance. *For more details, please download the PDF below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7159 Two-component heating hardening epoxy resin Features: Cured with anhydride, short curing time, high thermal conductivity (1.0 W/mK), flame retardant equivalent to UL94 V-0. Due to the anhydride curing, it has a long usable time after mixing the two components (approximately 6 to 8 hours). Applications: Potting for various electronic components ■ Thermal conductivity: 1.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 100°C x 2h

• Other polymer materials
• Other consumables

TE-7105 Two-component heating hardening epoxy resin Features: Acid anhydride curing, short curing time, flame retardant equivalent to UL94 V-0 Applications: Potting for various electronic components ■ Mixing viscosity: 9,500 at 25℃ ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 100℃ for 2 hours *For more details, please download the PDF from the bottom or feel free to contact us.

• Other polymer materials
• Other consumables

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7900 Two-component heating curing epoxy resin Features: High thermal conductivity (heat dissipation), excellent workability of 3W/mK, low viscosity, environmentally friendly (non-lead, non-halogen), low thermal expansion *The linear expansion coefficient is low at 16, making it less prone to cracking. Applications: Heat dissipation insulation sealing for industrial motors, coils, transformers, capacitors, etc. ■ Thermal conductivity: 3.0 (W/mK) *For more details, please download the PDF from below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7162 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■ Thermal conductivity: 1.0 (W/mK) * For more details, please download the specification sheet from below. * For other thermal conductive resin products, please download the catalog for epoxy & acrylic resins "TERADITE" from below.

• Other polymer materials
• Other consumables