寺田 Product Lineup

"TE-6409FR" is a two-component transparent epoxy resin suitable for electronic component encapsulation and craft applications where transparency is required. The mixing ratio of the base agent to the hardener is 100:50, and the mixed viscosity is only 500 mPa·s, making it a low-viscosity design that allows for easy filling of details and uniform coating. It demonstrates over 90% transparency (420-600nm transmission) and is suitable for applications where appearance quality is important. Furthermore, it achieves excellent yellowing resistance, showing no discoloration even after a heat resistance test at 120°C for 1,000 hours, combining aesthetics with reliability. Additionally, it is flame-retardant, contributing to safety assurance. Applications include electronic component encapsulation, transparent panels, clear photo panels, and art crafts, making it versatile across various fields. 【Features】 ■ Two-component transparent epoxy resin (mixing ratio 100:50) ■ High transparency (over 90% transmission at 420-600nm) ■ Excellent workability with low viscosity of 500 mPa·s *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-7814V" is a two-component, heat-curing epoxy resin suitable for heat dissipation sealing applications in electronic and electrical equipment. Its low viscosity design allows it to accommodate complex component shapes, significantly improving workability and production efficiency. This product has a thermal conductivity of 2.5 W/m·K, making it effective for heat dissipation measures in electronic components that generate heat. It can be widely used in fields that require high performance, such as electronic devices and power modules. 【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Suitable for complex component shapes due to low viscosity - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices *For details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-6430" is a two-component, room-temperature curing epoxy resin (hard type) developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to its ability to cure at room temperature, and it remains low in viscosity after mixing, making it easy to handle. This product has a thermal conductivity of 2.4 W/m·K, making it effective for heat dissipation measures for electronic components that generate heat. Additionally, it possesses flame retardancy equivalent to UL94 V-0 (5mm thickness), allowing for safe use in applications where safety is a concern. 【Features】 ■ Two-component, room-temperature curing epoxy resin (hard type) ■ High thermal conductivity: 2.4 W/m·K ■ Flame retardancy: UL94 V-0 equivalent (5mm thickness) ■ Good workability with low viscosity after mixing ■ High insulation and low water absorption improve the reliability of electronic devices *For more details, we have published the product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Resin container

The TE-7172K3 is a two-component, room-temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It can cure at 25°C without the need for heating equipment, making it energy-efficient and adaptable to flexible production processes. Its most notable feature is its high thermal conductivity of 3.3 W/m·K, which is effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb stress and prevent cracking in substrates and modules. The cured material exhibits balanced properties with a glass transition temperature of -20°C, a coefficient of linear expansion of 24 ppm/K, and a Shore D hardness of 45, combining heat resistance and flexibility. Moreover, it has flame retardant properties (equivalent to UL94 V-0 at 5mm thickness), making it safe for use in electronic devices that require safety. This improved version enhances heat resistance and toughness while inheriting the features of the conventional TE-7172K2. Applications include gap fillers, heat dissipation insulation materials, and encapsulation of electronic components where stress relief is required.

• Other polymer materials
• Other electronic parts

TE-7172K2 is an epoxy resin with high thermal conductivity (3W/m·K) and flexibility. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical equipment where stress relief is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.

• Other polymer materials
• Other electronic parts

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials
• Other electronic parts
• glue

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

• Other polymer materials
• glue
• Other electronic parts

TE-1002FR is an epoxy-based adhesive with flame retardancy equivalent to UL94 V-0 (5mm thick). It can be used for bonding, fixing, and sealing in areas where flame retardancy is required. Two-component room temperature curing epoxy resin Features: Room temperature curing, high adhesion strength, flame retardancy *Samples are available upon request. Please contact us for more details. *For more information about this product, please download the specification sheet from below. *For other products, please download the catalog and epoxy & acrylic resin "TERADITE" from below.

• Other polymer materials
• glue
• Other consumables

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

• Other polymer materials
• glue
• Other electronic parts

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160FL is transparent and compatible with fluorescent emission, using toluene as a diluent solvent.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160BP-TF is blue and transparent, using IPA as a diluent solvent, and is a toluene-free type. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160TF is transparent and uses IPA as a diluent solvent, and it is a toluene-free type. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160B-N is transparent blue and uses toluene as a diluent solvent. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

Araldite is an epoxy-based adhesive manufactured by Huntsman, used in advanced technology fields such as electronics, automotive, and aerospace around the world, earning high reliability. Araldite 420AB excels in shear and peel strength and can bond to a variety of materials. In addition to metals, it demonstrates high adhesion to CFRP and GFRP. *This is a stock item. *For details, please check the documentation or contact us. *The TDS is available in English.

• Composite Materials
• Other polymer materials
• glue

Araldite is an epoxy adhesive manufactured by Huntsman, which is used in advanced technology fields such as electronics, automotive, and aerospace around the world, earning high reliability. Rapid is an epoxy adhesive that is filled in a tube for ease of use, featuring the same high reliability. It can bond a wide range of materials including metal, ceramics, rubber, and rigid plastics. *For more details, please check the materials or contact us. *RAPID and 2012 contain the same contents.

• Composite Materials
• Other polymer materials
• glue

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160 is transparent and uses toluene as a diluent solvent. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

This is a two-component epoxy-based fast-curing adhesive from the global chemical manufacturer Huntsman. It features a usable time of 4 to 8 minutes and rapid curing at room temperature. Although it is in paste form, it has thixotropic properties, allowing for gap filling. While it is not as fast-curing as RAPID (2012), it has high heat resistance. It exhibits adhesion to various substrates such as metals, ceramics, and rubber. *For more details, please check the property table below or contact us.*

• Other polymer materials
• glue

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a low-viscosity transparent adhesive suitable for bonding glass and ceramics, as well as for transparent casting and laminating. It has a refractive index equivalent to that of glass. *Please note that the 2020 Hardener is classified as a hazardous substance. *For details, please check the properties table below or contact us.

• Other polymer materials
• glue
• Coating Agent

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has excellent chemical resistance and can withstand temperatures up to 140°C. Additionally, it is thixotropic and suitable for gap filling. For more details, please check the properties table below or contact us. *Please note that the hardener HV998-1 is classified as a hazardous substance.

• Other polymer materials
• glue

This is a general-purpose two-component epoxy adhesive from Huntsman, a global chemical manufacturer. It has high toughness and shear and peel adhesion strength, providing a wide range of adhesion to various substrates such as metals, ceramics, rubber, and rigid plastics. It excels in electrical insulation properties and has a proven track record in the electrical field. For more details, please check the specifications table below or contact us. *Please note that the hardener HV953U J CI is classified as a hazardous substance.

• Other polymer materials
• glue

This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a tough paste that can bond GRP, SMC, and dissimilar materials, and can fill gaps. It does not sag even when applied thickly. For details, please check the properties table below or contact us. It is a non-hazardous substance, making it easy to manage and handle.

• Other polymer materials
• glue

The H-2715 is a glass cloth with a thickness of 0.14mm, coated with a heat-resistant and chemical-resistant acrylic adhesive, resulting in a total thickness of 0.19mm for this glass cloth adhesive tape. The combination of glass fiber and acrylic adhesive allows for heat resistance without any change in physical properties. 【Features】 ■ Total thickness is 0.18mm ■ Heat resistance without change in physical properties ■ UL certified (UL510FR, UL temperature rating: 155℃) ■ Effective insulation and heat resistance ■ Coated with heat-resistant and chemical-resistant acrylic adhesive on 0.14mm thick glass cloth *For more details, please refer to the PDF document or feel free to contact us. *There is also a product number S-2115, which is coated with silicone adhesive and has a heat resistance of 200℃. https://www.ipros.jp/product/detail/2000607760 *The tape in the image has a plastic core, but our stock items have a paper core.

• Inductor Coil
• Transformers
• Adhesive tape

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has a heat resistance of up to 140°C and particularly high chemical and water resistance, making it suitable for bonding various materials such as metals, electronic components, and glass. Due to its high heat resistance, it can also be used in relatively high-temperature environments. For more details, please check the documentation or contact us. *Please note that the 2014-2 hardener is classified as a hazardous substance.

• Other polymer materials
• glue

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has good weather resistance and chemical resistance, and it comes in a paste form with a metallic color that can be applied to vertical surfaces. This is a general-purpose grade paste adhesive. If you prefer a low-viscosity product, please consider 2011 or 2012 (RAPID). For more details, please check the documentation or contact us. *Please note that 2013-1 has a hardener that is classified as a toxic substance.

• Other polymer materials
• glue

This is a two-component epoxy fast-curing adhesive from the global chemical manufacturer Huntsman. It cures rapidly at room temperature, has high shear and peel adhesion strength, and offers a wide range of adhesion to various substrates. *For more details, please refer to the materials or contact us.*

• Other polymer materials
• glue

This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has high toughness and shear and peel adhesion strength, providing a wide range of adhesion to various substrates such as metal, ceramics, rubber, and rigid plastics. *For details, please check the property table below or contact us. *Please note that the 2011 Hardener is classified as a hazardous substance.

• Other polymer materials
• glue

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. The 96S is characterized by its high hardness and flame retardancy. There is also a 96SB with a black main agent color (no change in properties other than color). For details, please check the property table below or contact us. 96S (Main agent color: light yellow) Main agent: Polyol 3002S Hardener: Isocyanate 2025-1 96SB (Main agent color: black) Main agent: Polyol 3002SB Hardener: Isocyanate 2025-1 *In 2024, due to a change in raw materials, Isocyanate 2025 was changed to Isocyanate 2025-1.

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 3002SB/2056 is characterized by its balanced performance. For details, please check the properties table below or contact us. Main agent: Polyol 3022SB Hardener: Isocyanate 2056

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 94S is characterized by its low hardness and flame retardancy. There is also a 94SB with a black main agent color (no change in properties other than color). For details, please check the property table below or contact us. 94S (Main agent color: light yellow) Main agent: Polyol 3006S Hardener: Isocyanate 2025-1 94SB (Main agent color: black) Main agent: Polyol 3006SB Hardener: Isocyanate 2025-1 *In 2024, due to a change in raw materials, Isocyanate 2025 was changed to Isocyanate 2025-1.

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 66B is characterized by its elasticity and low hardness. For details, please check the property table below or contact us. Main agent: Polyol 3618B Hardener: Isocyanate 2023

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 22BF features a low viscosity and shortened curing time based on the elasticity and low hardness of 22B. For more details, please check the property table below or contact us. Main agent: Polyol 3018BF Curing agent: Isocyanate 2023

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 22B is characterized by its elasticity and low hardness. For details, please check the property table below or contact us. Main agent: Polyol 3018B Hardener: Isocyanate 2023

• Other polymer materials
• Other electronic parts

At Terada Co., Ltd., we handle the PVC tape 'VP3WHA'. There is almost no adhesive residue when removed, so it can be used for masking and temporary fixing in places where heat resistance is not required. The color is dark blue. 【Usage (excerpt)】 ■ Base material type: Polyvinyl chloride ■ Adhesive type: Rubber-based ■ Base material thickness: 0.1mm ■ Total tape thickness: 0.112±0.03 ■ Adhesive strength N/25mm: 5 or more *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape

In recent years, with the miniaturization and high integration of components, there has been a demand for thermally conductive epoxy resins as insulating materials, and stress relief has also become necessary. In response to this need, we have developed a flexible thermal conductive resin series. This product series features low viscosity for ease of use and has thermal conductivity ranging from 0.9 to 2.8 W/m·K. In addition to the conventional heat-curing type, we also offer an environmentally friendly room-temperature curing type. Both types are two-component systems. We also have products that are non-flexible but offer higher thermal conductivity. For more details, please download the PDF "Introduction to TERADITE [Updated on 2024/8/1]" from the link below or check the product page. https://www.ipros.jp/product/detail/2001118658 *For product details, please download the PDF from the link below or feel free to contact us. *On 2024/8/1, the PDF for TE-7172 was replaced with the improved model number TE-7172K. *On 2024/9/24, the PDF for TE-7170 was replaced with the improved model number TE-7170K.

• Other polymer materials

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

• Other polymer materials

This is a highly transparent resin with a transmittance of over 95%. It has excellent weather resistance, is less prone to yellowing, and can be used widely from crafts to electronic components. Due to its high flexibility, it excels in conformity and crack resistance. Additionally, TE-6408BL6 absorbs ultraviolet light in the UV range (approximately below 450nm), making it a resin with low yellowing and high weather resistance. 【Features】 ■ High transparency ■ Room temperature curing two-component epoxy resin (25℃×20h) ■ Flexibility (Shore A 60) ■ High weather resistance 【Applications】 ■ Coatings ■ Adhesives ■ Crafts *For more details, please download the PDF below or feel free to contact us. *Samples are available, so please inquire.

• Other polymer materials
• glue
• lens

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a maximum Tg of 308°C. These liquid epoxy resins can also be used in areas requiring high heat resistance outside the field of electronic devices. Currently, we are providing a specification sheet and thermal test data for some products! For more details, please check the PDF download below. Feel free to contact us with any inquiries.

• Other polymer materials

TE-6410 (Product image coming soon) Two-component epoxy resin Features: Low Tg (flexibility), CFRP, high plastic adhesion Applications: Adhesives, sealants Mixing ratio 100:170 ... Pot life 4 hours Mixing ratio 100:200 ... Pot life 2 hours 【Specifications (excerpt)】 ■ Mixing viscosity: 25℃ 36,000 (mPa·s) ■ Glass transition temperature: -50℃ ■ Shear adhesion strength: 18 (MPa) CFRP/CFRP at 25℃ and others ■ Recommended curing conditions: 25℃ x 36h, 60℃ x 5h

• glue

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials
• Printed Circuit Board
• Other electronic parts