寺田 List of Products and Services

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 66B is characterized by its elasticity and low hardness. For details, please check the property table below or contact us. Main agent: Polyol 3618B Hardener: Isocyanate 2023

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 22BF features a low viscosity and shortened curing time based on the elasticity and low hardness of 22B. For more details, please check the property table below or contact us. Main agent: Polyol 3018BF Curing agent: Isocyanate 2023

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 22B is characterized by its elasticity and low hardness. For details, please check the property table below or contact us. Main agent: Polyol 3018B Hardener: Isocyanate 2023

• Other polymer materials
• Other electronic parts

At Terada Co., Ltd., we handle the PVC tape 'VP3WHA'. There is almost no adhesive residue when removed, so it can be used for masking and temporary fixing in places where heat resistance is not required. The color is dark blue. 【Usage (excerpt)】 ■ Base material type: Polyvinyl chloride ■ Adhesive type: Rubber-based ■ Base material thickness: 0.1mm ■ Total tape thickness: 0.112±0.03 ■ Adhesive strength N/25mm: 5 or more *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape

In recent years, with the miniaturization and high integration of components, there has been a demand for thermally conductive epoxy resins as insulating materials, and stress relief has also become necessary. In response to this need, we have developed a flexible thermal conductive resin series. This product series features low viscosity for ease of use and has thermal conductivity ranging from 0.9 to 2.8 W/m·K. In addition to the conventional heat-curing type, we also offer an environmentally friendly room-temperature curing type. Both types are two-component systems. We also have products that are non-flexible but offer higher thermal conductivity. For more details, please download the PDF "Introduction to TERADITE [Updated on 2024/8/1]" from the link below or check the product page. https://www.ipros.jp/product/detail/2001118658 *For product details, please download the PDF from the link below or feel free to contact us. *On 2024/8/1, the PDF for TE-7172 was replaced with the improved model number TE-7172K. *On 2024/9/24, the PDF for TE-7170 was replaced with the improved model number TE-7170K.

• Other polymer materials

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

• Other polymer materials

This is a highly transparent resin with a transmittance of over 95%. It has excellent weather resistance, is less prone to yellowing, and can be used widely from crafts to electronic components. Due to its high flexibility, it excels in conformity and crack resistance. Additionally, TE-6408BL6 absorbs ultraviolet light in the UV range (approximately below 450nm), making it a resin with low yellowing and high weather resistance. 【Features】 ■ High transparency ■ Room temperature curing two-component epoxy resin (25℃×20h) ■ Flexibility (Shore A 60) ■ High weather resistance 【Applications】 ■ Coatings ■ Adhesives ■ Crafts *For more details, please download the PDF below or feel free to contact us. *Samples are available, so please inquire.

• Other polymer materials
• glue
• lens

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a maximum Tg of 308°C. These liquid epoxy resins can also be used in areas requiring high heat resistance outside the field of electronic devices. Currently, we are providing a specification sheet and thermal test data for some products! For more details, please check the PDF download below. Feel free to contact us with any inquiries.

• Other polymer materials

TE-6410 (Product image coming soon) Two-component epoxy resin Features: Low Tg (flexibility), CFRP, high plastic adhesion Applications: Adhesives, sealants Mixing ratio 100:170 ... Pot life 4 hours Mixing ratio 100:200 ... Pot life 2 hours 【Specifications (excerpt)】 ■ Mixing viscosity: 25℃ 36,000 (mPa·s) ■ Glass transition temperature: -50℃ ■ Shear adhesion strength: 18 (MPa) CFRP/CFRP at 25℃ and others ■ Recommended curing conditions: 25℃ x 36h, 60℃ x 5h

• glue

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials
• Printed Circuit Board
• Other electronic parts

TERAELL is our high-performance fluoropolymer. Please use it for various coatings, water and oil repellents, and release agents. TRA-1030 is a non-fluorinated water repellent. 【Applications】 ■ Precision release agent ... TRA-311 series (*NEW) ■ Water and oil repellent/anti-fouling coating ... TRA-311 (*NEW), TRA-1030 series (*NEW), TRA-1015 series ■ Conformal coating ... TRA-190411, TRA-310 (formerly TRA-191216) series

• Coating Agent

This is a silicone-based adhesive tape, heat-resistant up to 200°C, and anti-static polyimide adhesive tape. For general-purpose polyimide adhesive tape, please refer to YT-130AH at the link below. ➡YT-130AH: https://www.ipros.jp/product/detail/2000631203 The color is amber. Please check the photo on the left. Use it in situations where anti-static properties are required for various processes. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 6.37 (650) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

Our carbon paste has been loved for many years both domestically and internationally. The resistance values range from 10Ω to 2MΩ and have various features tailored to different applications. Additionally, various customizations are possible according to your requests. For more details, please refer to the PDF below. ■Main Applications - Static electricity prevention, electromagnetic wave shielding - Semi-fixed resistors, variable resistors - Sliding resistors - Contacts - Various sensors - Drone remote controls, etc.

• Other electronic parts
• Resistors
• Printed Circuit Board

The TERADITE adhesive series from Terada Corporation is an adhesive primarily designed for bonding various metals and plastics. It is made to order, but you can purchase it in small quantities (around a few hundred grams). Samples are also available, so if you are interested, please feel free to contact us. Additionally, customization according to customer requirements is possible. If you wish to customize, please do not hesitate to inquire. ■ Single-component heat-curing epoxy adhesive ■ Two-component room temperature-curing epoxy adhesive (Note: TE-6010 is a potting resin, but it has high suitability for bonding bake boards.) ■ Anaerobic curing (polyepoxy methacrylate) adhesive *For more details, please download the PDF document from the bottom or contact us.

• glue
• Other polymer materials
• Other electronic parts

This is a fluorine-based coating agent that does not contain PFOA and related substances and is not classified as a fire hazard. ■ Applications: Electronic substrates, LEDs, etc. ■ Application methods: DIP, dispenser, etc. ■ Drying time: DIP touch dry in 2 minutes, fully dry in 1 hour ■ Solid content concentration can be adjusted according to customer requirements ■ Option to choose the presence or absence of fluorescent agents

• Coating Agent
• Rust Inhibitor
• Printed Circuit Board

This is a list of our company's brand epoxy resin "Teradite" for two-component mixed epoxy resin used for tooling. It is usually in stock, so you can purchase it in small quantities. *Contents of the document* ■ For vacuum, pressure, and RIM molding surface gel coat ■ For heat-resistant laminating and heat-resistant backing ■ For general casting for pattern models and jigs ■ For gel coat for precision inspection jigs ■ For sand backing and laminating (available for summer and winter) ■ Workable resin for master models ■ Release agent (MO-7) For more details, please check the "PDF Download" at the bottom.

• Other polymer materials
• Resin mold
• plastic

Heat-curing phenolic conductive paint. It is a one-component type with recommended curing conditions of 200°C for 2 minutes. While screen printing is recommended for application, brushes and other tools can also be used. *For more details, please refer to the PDF document or feel free to contact us.

• paint
• Other polymer materials
• Other electronic parts

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has increased significantly. Our company offers grades of two-component liquid epoxy with thermal conductivity ranging from 1 to 6.5 W/mK. We also have a one-component product with a thermal conductivity of 4 W/mK. *NEW: As of September 6, 2024, we have published the specifications for a new development product with a thermal conductivity of 8.5 W/mK. Currently, we are distributing the specification sheets! For more details, please refer to the PDF download below. Feel free to contact us with any inquiries.

• Other electronic parts

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

• Other polymer materials
• Other electronic parts

TE-6311K8 2-component low specific gravity epoxy resin Features: Room temperature curing, low specific gravity Applications: Lightweighting of components, etc. 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 2,170 (mPa·s) ■Glass transition temperature: 34℃ ■Cured material specific gravity: 0.78 (water displacement method) ■Mixing ratio R/H: 100/36 ■Curing conditions: 25℃ x 24h (if heated, 40℃ x 12h, 60℃ x 3h)

• Other polymer materials
• Other electronic parts

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

• Other polymer materials
• Other electronic parts

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

• Other polymer materials
• Other electronic parts

It can be used for masking such as plating, as well as for splicing and carrier tape. The adhesive is applied thicker than our general-purpose polyester tape 152G, resulting in slightly higher adhesion. https://www.ipros.jp/product/detail/2000631228 (152G page) The color is green (photo in preparation). 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesion strength N/25mm (gf/25mm): 9.8 (1,000)

• Other consumables
• Adhesive tape
• Other electronic parts

TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TE-1005 (Product image in preparation) Two-component epoxy resin Features: Fast curing, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 24,000 (mPa·s) at 25℃ ■Pot life: 0.5 hours (at 25℃) ■Glass transition temperature: 45℃ ■Shear adhesive strength: 22 (MPa) SUS/SUS at 25℃ 　　　　　　　　　Substrate failure GL/GL at 25℃ ■Recommended curing conditions: 25℃ x 6h

• glue
• Other polymer materials
• Other consumables

TE-1004 (Product image in preparation) Two-component epoxy resin Features: High plastic adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 12,000 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 10℃ ■Shear adhesive strength: 7.7 (MPa) SUS/SUS 25℃ Substrate failure GL/GL 25℃ 1.8 (MPa) POM/POM ■Recommended curing conditions: 25℃ x 24h

• glue

TE-1003 (Product image in preparation) Two-component epoxy resin Features: High adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 97,000 (mPa·s) ■Pot life: 1 hour (25℃) ■Glass transition temperature: 33℃ ■Shear adhesive strength: 237 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

• glue
• Other polymer materials
• Other consumables

TE-1002 (Product image in preparation) Two-component epoxy resin Features: General-purpose, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 50,300 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 40℃ ■Shear adhesive strength: 23 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

• glue

TX-2610-2 (Product image in preparation) 1-component epoxy resin Features: General-purpose, heat-curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesive 【Specifications (excerpt)】 ■Viscosity: 12,000 (mPa·s) at 25℃ ■Glass transition temperature: 85℃ ■Shear adhesive strength: 20 (MPa) SUS/SUS at 25℃ ■Recommended curing conditions: 80℃ x 1h

• glue

CM3F is a standard crepe paper adhesive tape. It can be widely used for masking, temporary fixing, temporary stopping, surface protection, and more. 【Specifications (excerpt)】 ■ Base material type: Crepe paper ■ Adhesive type: Silicone-based ■ Total tape thickness (μm): 170 ■ Base material thickness (μm): 125 ■ Adhesive strength N/25mm (gf/25mm): 6.86 (700) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. The color is red. Please use it as a process tape for various heat-resistant masking and temporary fixing applications. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 60 ■ Adhesive strength N/25mm (gf/25mm): 6.52 (665)

• Adhesive tape
• Other consumables
• Other electronic parts

It can withstand temperatures up to 200℃ and can be used as various masking and heat-resistant process tapes. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 7.84 (800) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

It can withstand temperatures up to 200°C and can be used as various masking and heat-resistant process tapes. The adhesive is thick, with a total thickness of 100μm. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesive strength N/25mm (gf/25mm): 6.86 (700) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

This is a derivative model of the general-purpose polyimide adhesive tape, YT-130AH (➡https://www.ipros.jp/product/detail/2000631203). While maintaining the basic specifications such as adhesive strength, it has been specially processed to make it easier to pull out. The color is amber. Please check the photo on the left. The heat resistance is 200°C. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 6.57 (670) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

At Terada Co., Ltd., we handle the flat pack paper and polyester film composite tape 'CM8R'. Please use it in situations that require heat resistance, such as masking for solder levelers. 【Specifications (excerpt)】 ■ Base material type: Flat pack paper + Polyester ■ Adhesive type: Silicone-based ■ Total tape thickness (μm): 290 ■ Adhesive strength N/25mm (gf/25mm): 8.82 (900) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Printed Circuit Board

This is a double-sided adhesive tape made of thicker polyimide film. It has double the substrate thickness compared to the general-purpose YT-130AH. The color is amber. Please check the photo on the left. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Substrate type: Polyimide ■ Adhesive type: Silicone-based ■ Substrate thickness (μm): 50 ■ Total tape thickness (μm): 90 ■ Adhesive strength N/25mm (gf/25mm): 7.06 (720)

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. It is characterized by being thinner and having weaker adhesion compared to other tapes we handle. The color is brown. (Photo is being prepared.) Please use it as a process tape for various heat-resistant masking and temporary fixing. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 35 ■ Adhesive strength N/25mm (gf/25mm): 5.39 (550)

• Adhesive tape
• Other consumables
• Printed Circuit Board

At Terada Corporation, we handle the polyester adhesive tape 'YT-152G'. It can be used for masking in processes such as plating, as well as for splicing and carrier tape. The color is a bright green. Please check the photo on the left. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 80 ■ Adhesive strength N/25mm (gf/25mm): 8.62 (880)

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of general-purpose polyimide film. For double-sided tape, please refer to the YT-130DJ below. ➡YT-130DJ: https://www.ipros.jp/product/detail/2000607744 The color is amber. Please check the photo on the left. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■Base material type: Polyimide ■Adhesive type: Silicone-based ■Base material thickness (μm): 25 ■Total tape thickness (μm): 65 ■Adhesive strength N/25mm (gf/25mm): 6.57 (670) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.

• High frequency/microwave parts
• Printed Circuit Board
• Other electronic parts

TE-8008 2-component mixed epoxy resin Features: Flexibility, thermal conductivity, environmentally friendly, flame retardant equivalent to V-0, Applications: Sealing and molding for electrical and electronic components requiring crack resistance *Heat resistance is approximately 100°C. *For more details, please download the characteristic table PDF from below or feel free to contact us. *For flexible resins of other grades, please refer to the PDF document "Epoxy & Acrylic Resins 'TERADITE'" available below.

• Other polymer materials
• Other electronic parts

■Appearance: Milky white liquid ■Viscosity: 10–20 (mPa.s/25℃) ■Working temperature: 20–25℃ ■Packaging: 1L, 15L *For more details, please download the PDF from the bottom or feel free to contact us.*

• Other polymer materials

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

• Other polymer materials
• Other consumables