寺田 List of Products and Services

TE-6311K8 2-component low specific gravity epoxy resin Features: Room temperature curing, low specific gravity Applications: Lightweighting of components, etc. 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 2,170 (mPa·s) ■Glass transition temperature: 34℃ ■Cured material specific gravity: 0.78 (water displacement method) ■Mixing ratio R/H: 100/36 ■Curing conditions: 25℃ x 24h (if heated, 40℃ x 12h, 60℃ x 3h)

• Other polymer materials
• Other electronic parts

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

• Other polymer materials
• Other electronic parts

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

• Other polymer materials
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. It is the product with the highest heat resistance among the polyester film adhesive tapes we handle. The color is green. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesive strength N/25mm (gf/25mm): 7.84 (800)

• Adhesive tape
• Other consumables
• Other electronic parts

It can be used for masking such as plating, as well as for splicing and carrier tape. The adhesive is applied thicker than our general-purpose polyester tape 152G, resulting in slightly higher adhesion. https://www.ipros.jp/product/detail/2000631228 (152G page) The color is green (photo in preparation). 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesion strength N/25mm (gf/25mm): 9.8 (1,000)

• Other consumables
• Adhesive tape
• Other electronic parts

TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

• Other polymer materials
• Coating Agent

TE-1005 (Product image in preparation) Two-component epoxy resin Features: Fast curing, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 24,000 (mPa·s) at 25℃ ■Pot life: 0.5 hours (at 25℃) ■Glass transition temperature: 45℃ ■Shear adhesive strength: 22 (MPa) SUS/SUS at 25℃ 　　　　　　　　　Substrate failure GL/GL at 25℃ ■Recommended curing conditions: 25℃ x 6h

• glue
• Other polymer materials
• Other consumables

TE-1004 (Product image in preparation) Two-component epoxy resin Features: High plastic adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 12,000 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 10℃ ■Shear adhesive strength: 7.7 (MPa) SUS/SUS 25℃ Substrate failure GL/GL 25℃ 1.8 (MPa) POM/POM ■Recommended curing conditions: 25℃ x 24h

• glue

TE-1003 (Product image in preparation) Two-component epoxy resin Features: High adhesion, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 97,000 (mPa·s) ■Pot life: 1 hour (25℃) ■Glass transition temperature: 33℃ ■Shear adhesive strength: 237 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

• glue
• Other polymer materials
• Other consumables

TE-1002 (Product image in preparation) Two-component epoxy resin Features: General-purpose, room temperature curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesives, sealants 【Specifications (excerpt)】 ■Mixing viscosity: 25℃ 50,300 (mPa·s) ■Pot life: 1.5 hours (25℃) ■Glass transition temperature: 40℃ ■Shear adhesive strength: 23 (MPa) SUS/SUS 25℃ 　　　　　　　　　Substrate failure GL/GL 25℃ ■Recommended curing conditions: 25℃ x 24h

• glue

TX-2610-2 (Product image in preparation) 1-component epoxy resin Features: General-purpose, heat-curing, high shear adhesive strength (fracture surface shows cohesive failure) Applications: Adhesive 【Specifications (excerpt)】 ■Viscosity: 12,000 (mPa·s) at 25℃ ■Glass transition temperature: 85℃ ■Shear adhesive strength: 20 (MPa) SUS/SUS at 25℃ ■Recommended curing conditions: 80℃ x 1h

• glue

CM3F is a standard crepe paper adhesive tape. It can be widely used for masking, temporary fixing, temporary stopping, surface protection, and more. 【Specifications (excerpt)】 ■ Base material type: Crepe paper ■ Adhesive type: Silicone-based ■ Total tape thickness (μm): 170 ■ Base material thickness (μm): 125 ■ Adhesive strength N/25mm (gf/25mm): 6.86 (700) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. The color is red. Please use it as a process tape for various heat-resistant masking and temporary fixing applications. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 60 ■ Adhesive strength N/25mm (gf/25mm): 6.52 (665)

• Adhesive tape
• Other consumables
• Other electronic parts

It can withstand temperatures up to 200℃ and can be used as various masking and heat-resistant process tapes. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 7.84 (800) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

It can withstand temperatures up to 200°C and can be used as various masking and heat-resistant process tapes. The adhesive is thick, with a total thickness of 100μm. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 100 ■ Adhesive strength N/25mm (gf/25mm): 6.86 (700) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

This is a derivative model of the general-purpose polyimide adhesive tape, YT-130AH (➡https://www.ipros.jp/product/detail/2000631203). While maintaining the basic specifications such as adhesive strength, it has been specially processed to make it easier to pull out. The color is amber. Please check the photo on the left. The heat resistance is 200°C. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Base material type: Polyimide ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 65 ■ Adhesive strength N/25mm (gf/25mm): 6.57 (670) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

At Terada Co., Ltd., we handle the flat pack paper and polyester film composite tape 'CM8R'. Please use it in situations that require heat resistance, such as masking for solder levelers. 【Specifications (excerpt)】 ■ Base material type: Flat pack paper + Polyester ■ Adhesive type: Silicone-based ■ Total tape thickness (μm): 290 ■ Adhesive strength N/25mm (gf/25mm): 8.82 (900) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Printed Circuit Board

This is a double-sided adhesive tape made of thicker polyimide film. It has double the substrate thickness compared to the general-purpose YT-130AH. The color is amber. Please check the photo on the left. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■ Substrate type: Polyimide ■ Adhesive type: Silicone-based ■ Substrate thickness (μm): 50 ■ Total tape thickness (μm): 90 ■ Adhesive strength N/25mm (gf/25mm): 7.06 (720)

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of polyester film. It is characterized by being thinner and having weaker adhesion compared to other tapes we handle. The color is brown. (Photo is being prepared.) Please use it as a process tape for various heat-resistant masking and temporary fixing. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 35 ■ Adhesive strength N/25mm (gf/25mm): 5.39 (550)

• Adhesive tape
• Other consumables
• Printed Circuit Board

At Terada Corporation, we handle the polyester adhesive tape 'YT-152G'. It can be used for masking in processes such as plating, as well as for splicing and carrier tape. The color is a bright green. Please check the photo on the left. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 25 ■ Total tape thickness (μm): 80 ■ Adhesive strength N/25mm (gf/25mm): 8.62 (880)

• Adhesive tape
• Other consumables
• Other electronic parts

This is a one-sided adhesive tape made of general-purpose polyimide film. For double-sided tape, please refer to the YT-130DJ below. ➡YT-130DJ: https://www.ipros.jp/product/detail/2000607744 The color is amber. Please check the photo on the left. Please use it for various heat-resistant masking and splicing applications. 【Specifications (excerpt)】 ■Base material type: Polyimide ■Adhesive type: Silicone-based ■Base material thickness (μm): 25 ■Total tape thickness (μm): 65 ■Adhesive strength N/25mm (gf/25mm): 6.57 (670) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Other electronic parts

In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.

• High frequency/microwave parts
• Printed Circuit Board
• Other electronic parts

TE-8008 2-component mixed epoxy resin Features: Flexibility, thermal conductivity, environmentally friendly, flame retardant equivalent to V-0, Applications: Sealing and molding for electrical and electronic components requiring crack resistance *Heat resistance is approximately 100°C. *For more details, please download the characteristic table PDF from below or feel free to contact us. *For flexible resins of other grades, please refer to the PDF document "Epoxy & Acrylic Resins 'TERADITE'" available below.

• Other polymer materials
• Other electronic parts

■Appearance: Milky white liquid ■Viscosity: 10–20 (mPa.s/25℃) ■Working temperature: 20–25℃ ■Packaging: 1L, 15L *For more details, please download the PDF from the bottom or feel free to contact us.*

• Other polymer materials

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

• Other polymer materials
• Other consumables

TE-6010 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, non-toxic, non-halogenated, flame retardant equivalent to V-0 Good adhesion to bake boards, environmentally friendly with room temperature curing Applications: Sealing and casting for various electrical and electronic components ■ Mixing viscosity: 2,300 (mPa·s) at 25°C ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 50°C for 10 hours (can also cure at room temperature)

• Other polymer materials
• Other consumables

E-1 Two-component liquid curing epoxy resin Features: Amine curing (can cure at room temperature), low elastic modulus, crack resistance, available in small quantities with short delivery times due to stock availability Applications: Sealing and molding for various electrical and electronic components ■ Recommended curing conditions: 25°C x 24h *Please be cautious when handling E-1 as the hardener is classified as a hazardous substance. *For more details, please download the PDF below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7159 Two-component heating hardening epoxy resin Features: Cured with anhydride, short curing time, high thermal conductivity (1.0 W/mK), flame retardant equivalent to UL94 V-0. Due to the anhydride curing, it has a long usable time after mixing the two components (approximately 6 to 8 hours). Applications: Potting for various electronic components ■ Thermal conductivity: 1.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 100°C x 2h

• Other polymer materials
• Other consumables

TE-7105 Two-component heating hardening epoxy resin Features: Acid anhydride curing, short curing time, flame retardant equivalent to UL94 V-0 Applications: Potting for various electronic components ■ Mixing viscosity: 9,500 at 25℃ ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 100℃ for 2 hours *For more details, please download the PDF from the bottom or feel free to contact us.

• Other polymer materials
• Other consumables

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7900 Two-component heating curing epoxy resin Features: High thermal conductivity (heat dissipation), excellent workability of 3W/mK, low viscosity, environmentally friendly (non-lead, non-halogen), low thermal expansion *The linear expansion coefficient is low at 16, making it less prone to cracking. Applications: Heat dissipation insulation sealing for industrial motors, coils, transformers, capacitors, etc. ■ Thermal conductivity: 3.0 (W/mK) *For more details, please download the PDF from below or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

• Other polymer materials
• Other consumables

TE-7162 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■ Thermal conductivity: 1.0 (W/mK) * For more details, please download the specification sheet from below. * For other thermal conductive resin products, please download the catalog for epoxy & acrylic resins "TERADITE" from below.

• Other polymer materials
• Other consumables

■Purpose: Stain protection coating for clothing, seats, etc. ■Application method: Dipping, spraying, etc. ■Drying time: [Air drying] 24 hours at 25°C or higher, 48 hours at 15-24°C [Heat drying] 30 minutes at 80°C or higher (maximum 170°C, dry immediately after application) or 10 minutes at 80°C after 2 hours of drying at room temperature (above 10°C)

• Coating Agent

At Terada Co., Ltd., we handle the polyester adhesive tape 'YT-153S'. We also have the separator-equipped YT-153SL available. It can be used for plating masking, painting masking, and as carrier tape. The color is green. Please check the photo. 【Specifications (excerpt)】 ■ Base material type: Polyester ■ Adhesive type: Silicone-based ■ Base material thickness (μm): 50 ■ Total tape thickness (μm): 90 ■ Adhesive strength N/25mm (gf/25mm): 12.74 (1,300) ■ Separator: Fluorine-coated PET (color: transparent) *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• paint
• Other electronic parts

Introducing Jinzhou Precision Industry, headquartered in Shenzhen, China, which boasts the world's top market share in drill and router bits for printed circuit board hole processing. This catalog features router bits from Jinzhou Precision Industry Co., Ltd. We use tungsten alloy round bars from a leading Japanese hard alloy manufacturer and produce our products in a factory equipped with the latest automated facilities in Shenzhen. [Contents (excerpt)] ■ Drills for printed circuit board processing ■ Router bits for printed circuit board processing ■ Newly developed products for the above two items ■ Cutting parameter calculation formulas *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board
• drill
• End Mills

Introducing Jinzhou Precision Technology Co., Ltd., headquartered in Shenzhen, China, which boasts the world's top market share in drills and router bits for printed circuit board processing. This catalog contains product information from Jinzhou Precision Technology Co., Ltd. We use tungsten round bars from top Japanese manufacturers as materials and produce them in our factory equipped with the latest automated facilities in Shenzhen. We also offer special types with in-house coatings. (Please inquire separately as these are not listed in the catalog.) 【Contents (Excerpt)】 ■ Drills for printed circuit board processing ■ Router bits for printed circuit board processing ■ Coated products ■ Newly developed products of the above two items (2024 latest version) ■ Cutting parameter calculation formulas *For more details, please refer to the PDF document or feel free to contact us.

• drill

This is a coating agent that dissolves non-fluorinated resin in a fluorinated solvent. This allows it to have the drying properties of fluorine while overcoming the disadvantages of fluorine coatings. ■ Applications: Electronic substrates, LEDs, etc. ■ Application methods: DIP, dispenser, etc. ■ Drying time: DIP touch dry in 2 minutes, fully dry in 1 hour ■ Film thickness: Dip 20μm (8wt% concentration) ■ Solid content concentration can be adjusted according to customer requests ■ Option to choose the presence or absence of fluorescent agents 2025.2.25 Renewed from old product number TRA-191216 to TRA-310.

• Coating Agent
• Rust Inhibitor
• Printed Circuit Board

The TERAELL series TRA-311 is our high-performance fluororesin. The solid content concentration can be adjusted according to customer requirements. Recommended substrates: Glass, metal (separate primer available for plastic and some metals) Recommended application methods: Spin coating, DIP, coater Available sizes: 1kg, 15kg 【Features】 ■ Development product ■ Low global warming potential, free of PFOA and PFHx substances ■ Repels water, oil, and alcohol-based organic solvents ■ Excellent stain removal properties (for anti-fouling applications) ■ Reusable (for release applications) *For more details, please refer to the PDF document or feel free to contact us.

• Coating Agent

At Terada Co., Ltd., we handle the surface protection tape 'CM Series'. The various types of surface protection tape include those for masking in the solder leveling process of printed circuit boards, as well as for protecting surfaces during the transportation and processing of various materials. They can accommodate various surface conditions. There are also low-tack and weak-tack types available. 【Features】 ■ Production location: Taiwan ■ Heat resistance temperature: 250℃ ■ Can accommodate various surface conditions ■ Low-tack and weak-tack types are also available ■ Adhesive type is silicone-based *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Other consumables
• Printed Circuit Board

The product "S-2115/TH-GC012" is a glass cloth with a thickness of 0.14mm coated with a heat-resistant and chemical-resistant silicone adhesive, resulting in a total thickness of 0.19mm for the glass cloth adhesive tape. The combination of glass fiber and silicone adhesive allows for heat resistance without any change in physical properties. 【Features】 ■ Total thickness is 0.19mm ■ Heat resistance without change in physical properties ■ UL certified (UL510FR, UL temperature rating: 200℃) ■ Effective insulation and heat resistance ■ Coated with heat-resistant and chemical-resistant silicone adhesive on 0.14mm thick glass cloth *For more details, please refer to the PDF document or feel free to contact us.

• Adhesive tape
• Inductor Coil
• transformer