TE-7820FR3 for electronic devices

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last updated：Mar 12, 2026

寺田

High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.

In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion

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【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - High strength and high heat resistance (Tg = 174°C) - Excellent thermal cycle resistance with a low coefficient of thermal expansion (20 ppm/K) - Flame retardant: Equivalent to UL94 V-0 (2mm thickness) - High insulation properties (dielectric breakdown strength over 25 kV/mm, volume resistivity 4.0×10^16 Ω·cm) 【Our Strengths】 Terada Corporation has been providing its own products and materials across various industrial sectors, focusing on electronic devices and chemical products. Utilizing our expertise in resin and adhesive technology along with years of experience in the electronics industry, we contribute to solving our customers' challenges.