You can understand the specific formulation design of epoxy resin! A book that will be useful for technology development and product development!
○Publication Date: August 20, 2008 ○Format: B5 size hardcover, 249 pages ○Price: 55,000 yen (excluding tax) → STbook member price: 52,190 yen (excluding tax) ○Authors: Ichiro Ogura (DIC Corporation) / Yuya Morimoto (Air Products Japan, Inc.) / Masahiko Yamanaka (Shin Nihon Rika Co., Ltd.) / Hiroshi Moriyama (DIC Corporation) / Noboru Mizobe (Shikoku Chemical Industry Co., Ltd.) / Kenji Ohashi (Hokko Chemical Industry Co., Ltd.) / Toshio Nonaka (Toray Industries, Inc.) / Yoshinobu Nakamura (Osaka Institute of Technology) / Hajime Kishi (University of Hyogo) / Hirofumi Nishida (Nagase ChemteX Corporation) / Yasuyuki Kamitani (Osaka City Industrial Research Institute) / Masafumi Kaji (Nippon Steel Chemical Co., Ltd.) / Haruhiko Maeda (Sumitomo Bakelite Co., Ltd.) / Toshio Shimizu (Toshiba Corporation) / Miyuki Harada (Kansai University) / Shigeru Koshibe (Aipack Co., Ltd.) / Hiroyuki Yano (Nippon Steel Chemical Co., Ltd.) / Yutaka Tsujimura (Nagase ChemteX Corporation) / Nobuaki Tomita (Nippon Paint Co., Ltd.) / Yutaka Hatakeyama (NTT Advanced Technology Corporation) / Nobuyuki Sato (Toray Research Center, Inc.)
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basic information
Chapter 1: Relationship Between the Molecular Structure and Properties of Epoxy Resins Chapter 2: Properties and Usage of Epoxy Resin Hardener and Accelerator Section 1: Properties and Usage of Amine-Based Hardeners Section 2: Properties and Usage of Anhydride-Based Hardeners Section 3: Properties and Usage of Phenolic Hardeners Section 4: Properties and Usage of Imidazole-Based Accelerators Section 5: Properties and Usage of Phosphorus-Based Accelerators Chapter 3: High Functionality of Epoxy Resins Section 1: Enhancement of Epoxy Resins through Filler Composition Section 2: Toughening Section 3: Mechanism of Toughening Epoxy Resins through Polymer Microparticle Addition and Adhesive Strength Section 4: Internal Stress Section 5: Novel Flexible Tough Liquid Epoxy Resins Section 6: Technologies for Improving Thermal Conductivity and Heat Cycle Resistance of Epoxy Resins Section 7: Enhancement of Thermal Conductivity of Epoxy Resins through the Addition of Thermal Conductive Fillers Section 8: Improvement of Heat Resistance and Moisture Resistance of Epoxy Resins Section 9: Enhancement of Flame Retardancy of Epoxy Resins and Technologies for Flame Retardant-Free Solutions ~Section 18 Chapter 4: Organic Composition Analysis of Uncured and Cured Epoxy Resins
Price information
Main unit 55,000 yen + tax → STbook member price: 52,190 yen + tax
Price range
P2
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P2
Applications/Examples of results
Resin, plant
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S&T Publishing publishes technical books aimed at researchers and engineers.