[Book] Formulation Design and High Functionality of Epoxy Resins (No. 2222)

Available for trial reading - High heat resistance, high thermal conductivity and insulation, low dielectric constant, reinforcement -

★ The "concrete measures" that respond to the latest electronics implementation materials such as high-frequency substrates and semiconductor encapsulation can be understood from the examples of advanced companies! ★ Optimal selection of hardeners, usage amounts, and optimization of curing process conditions! Reduction of environmental impact through the realization of low-temperature rapid curing! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book 1 ● High heat resistance and high thermal conductivity ・ Long-term heat resistance for 5G/6G compatibility, power modules, etc. ・ Increased heat resistance through benzoxazine and bismaleimide modification ・ High filling of fillers with high thermal conductivity ・ Low dielectric constant that trades off with heat resistance ● Toughening and high strength ・ Compatibility with processability as CFRP matrix resin ・ Coatings with excellent self-healing and corrosion resistance ● High adhesion ・ Multi-material compatibility ・ Functions with excellent workability such as high viscosity and high room temperature stability ● Environmental considerations ・ Development of plant oil-derived resins ・ Recycling technology for epoxy resins and CFRP ・ Development of curing processes with low CO2 emissions ● Latest technologies and trouble countermeasures ・ Low-temperature rapid curing technology for epoxy resins ・ Countermeasures for mixing unevenness and troubles with hardeners ・ Data-driven approaches using MI ・ Evaluation of cured products containing many auxiliary materials

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