TECHNICAL INFOMATION INSTITUTE CO.,LTD List of News Articles

- Surface-active bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesives ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, micro LEDs, etc. Examples of new materials and processes for the development of advanced semiconductors, their possibilities, and verification results are included! ---------------------------- ■ Table of Contents Chapter 1: Bonding and adhesive technologies for advanced semiconductor packages, their material development, and reliability evaluation Chapter 2: Development and reliability evaluation of bonding materials and processes for power semiconductors Chapter 3: Development and reliability evaluation of bonding technologies and materials in electronic devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 423 ● ISBN: 978-4-86798-164-1 ----------------------------

~Chiplets, Responding to 2.5D/3D High-Density Packaging~ ◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages. ---------------------------- ■ Table of Contents Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion Chapter 3: Development Trends of Negative Thermal Expansion Materials Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction Chapter 7: Development of Bonding Materials Chapter 8: Development Trends of Low CTE Resin Materials Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4, 395 pages ● Authors: 33 ● ISBN: 978-4-86798-163-4 ----------------------------

◎ A Complete Manual for the Removal of Biofilms to Overcome "Slime" and "Resistance" for the Field! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Mechanisms of Biofilm Formation Chapter 2: Various Evaluation Methods for Biofilms Chapter 3: Evaluation Methods for the Development of Anti-Biofilm Products Chapter 4: Types and Characteristics of Anti-Biofilm Agents Chapter 5: Development of Anti-Biofilm Agents from the Perspective of Bacterial Adhesion Prevention Chapter 6: Mechanisms of Biofilm Formation Inhibition and Development of Anti-Biofilm Agents Chapter 7: Control, Removal, and Prevention Measures for Oral and Infection-Derived Biofilms Chapter 8: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Living Environments Chapter 9: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Food Chapter 10: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Factories, Machinery, and Piping －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: July 31, 2026 ● Format: A4, 384 pages ● Authors: 65 ● ISBN: 978-4-86798-161-0 －－－－－－－－－－－－－－－－－－－－－

- High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions - ★ Explaining the key points for organizing all internal and external data such as molecular structures, images, spectra, and literature/patent information into a usable form for MI! ---------------------------- ■ Table of Contents Chapter 1: Materials Development, Structural Design, and Applications through Materials Informatics Chapter 2: Molecular Design and Reaction Analysis for Materials Development, Descriptorization of Compounds Chapter 3: Optimization of Formulation Conditions, Prediction of Composition Ratios, and Extraction of Reaction Factors Using Machine Learning and Simulation Chapter 4: Collection, Analysis, and Processing of Experimental and Measurement Data for Materials Development and Process Design Chapter 5: Introduction and Operation of Autonomous Experiments and Automation Technologies in Materials Development ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4 size, 425 pages ● Authors: 41 ● ISBN: 978-4-86798-162-7 ----------------------------

- Necessary physical property values / Important relationships / Modeling / Utilization of AI - ★ No reliance on experience or intuition! Aiming for fast and accurate 'equipment design' and 'operating condition setting' based on calculation results! ★ Covers everything from the physical property values needed for calculations, important relationships, and modeling to the latest examples of AI utilization! ---------------------------- ■ Table of Contents Chapter 1: Basics of Chemical Engineering Chapter 2: Estimation of Physical Properties Chapter 3: Estimation and Simulation for Stirring, Mixing, Reaction Processes, and Equipment Design Chapter 4: Estimation and Simulation for Separation Processes and Equipment Design Chapter 5: Estimation and Simulation for Drying Processes and Equipment Design Chapter 6: Estimation and Simulation for Powder and Granular Processes and Equipment Design ---------------------------- ● Publication Date: June 30, 2026 ● Format: A4 size, 504 pages ● Authors: 35 contributors ● ISBN: 978-4-86798-157-3 ----------------------------

- Demand forecasting, marketing, logistics, anomaly detection, failure prediction, material exploration, synthesis prediction - ☆ Effective data to maximize forecasting accuracy!! ☆ Not just for improving operational efficiency and reducing costs! Methods to support rapid and flexible decision-making －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Basics of AI Forecasting Technology Chapter 2: Data and Optimal Forecasting Models Chapter 3: Demand Forecasting and Use Cases Chapter 4: Implementation and Utilization in Marketing Operations Chapter 5: Utilization in Logistics (Traffic Volume Forecasting and Delivery Planning, etc.) Chapter 6: Anomaly Detection, Failure Prediction, and Lifespan Prediction Chapter 7: Implementation and Utilization in Research and Development Operations Chapter 8: Decision-Making and Considerations －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: June 30, 2026 ● Format: A4 size, 388 pages ● Authors: 43 ● ISBN: 978-4-86798-155-9 －－－－－－－－－－－－－－－－－－－－－

- Visualization, Anomaly Detection, High-Precision Process Optimization - ◎ How can we achieve optimization of film formation and etching processes? ◎ A detailed explanation of the technology that visualizes plasma and connects to the control of electrons and ions! ◎ A thorough explanation of high-precision process technology for discharge and reactive plasma! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Basics of Plasma, Overview of Generation Devices, and Generation/Control Technologies Chapter 2: Design Technologies for Vacuum Environments Chapter 3: Plasma Measurement Technologies, Process Evaluation and Analysis Technologies Chapter 4: Monitoring and Predictive Maintenance Technologies in Plasma Processes Chapter 5: Film Formation Technologies Using Plasma and Low-Temperature Process and Analysis Technologies Chapter 6: Development of Light Sources and Equipment for EUV Lithography Chapter 7: Process Technologies for Plasma Etching and Ashing Chapter 8: Surface Treatment and Cleaning Technologies for Semiconductors Using Plasma －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: June 30, 2026 ● Format: A4, 395 pages ● Authors: 41 ● ISBN: 978-4-86798-156-6 －－－－－－－－－－－－－－－－－－－－－

★A comprehensive guide to the secret know-how of information gathering taught by experts in new business development! ★What is the true strength of generative AI? Learn the most effective ways to utilize it and key points! －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Basics of Information Gathering and Key Points for Research Chapter 2: Methods for Collecting Marketing Information and How to Interpret Results Chapter 3: How to Research Technical Information and Trends Chapter 4: Collecting and Analyzing Competitive Information and Creating Competitive Strategies Chapter 5: Methods for Information Gathering and Interpretation for Future Forecasting Chapter 6: How to Gather Information to Explore New Business Development Themes Chapter 7: How to Summarize Information, Make Selections, and Utilize It ■Key Points of This Book 1. How to collect information and interpret latent needs! 2. Where to utilize generative AI! What roles do humans play? 3. Key points for summarizing information, making selections, and exploring new businesses! －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: May 29, 2026 ●Format: A4, 557 pages ●Authors: 43 contributors ●ISBN: 978-4-86798-154-2 －－－－－－－－－－－－－－－－－－－－－

- Light, Heat, Ultrasound, Electricity, Chemical Reactions - ★ This book explains various methods and material development techniques that demonstrate excellent adhesion during use and allow for easy peeling without damage as needed, along with implementation examples! ---------------------------- ■ Table of Contents Chapter 1: Trends in Easily Disassemblable and Decomposable Materials Chapter 2: Development of Heat-Responsive Easily Disassemblable Materials Chapter 3: Development of Light-Stimuli Responsive Easily Disassemblable Materials Chapter 4: Development of Easily Disassemblable and Decomposable Materials through Chemical Reactions ■ Key Points of This Book ◎ Mechanisms of Adhesion and Peeling ◎ Characteristics of Various External Stimuli ◎ Prospects for Industrial Applications ---------------------------- ● Publication Date: May 29, 2026 ● Format: A4, 360 pages ● Authors: 40 contributors ● ISBN: 978-4-86798-153-5 ----------------------------

~TIM, immersion cooling, vapor chamber, water-cooled heat sink~ ★ Achieving both 'high-density, high-heat cooling' and 'high-efficiency operation' required in data centers, as well as 'instantaneous heat countermeasures' and 'slim design' for AI-equipped PCs and smartphones! ---------------------------- ■ Table of Contents Chapter 1: Market trends for AI and generative AI data centers and the required heat dissipation and cooling technologies Chapter 2: Development of heat dissipation materials and components for electronic devices running AI, HPC, etc., trends, and responses to high heat density Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI ---------------------------- ● Publication Date: March 31, 2026 ● Format: A4, 408 pages ● Authors: 40 ● ISBN: 978-4-86798-145-0 ----------------------------

～Responding to high-speed, large-capacity communication and high-speed transmission for AI servers～ ★A comprehensive overview of the development, challenges, and direction for high-frequency compatible semiconductor packaging! ★How to achieve a balance between dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Improvement of low dielectric properties and adhesion of polymer materials through molecular design Chapter 2: Development and application of additives to improve low dielectric properties and adhesion Chapter 3: Development and application of fillers and fiber materials to enhance low dielectric properties Chapter 4: Development of film materials with excellent dielectric properties Chapter 5: Development and application of low dielectric ceramic materials Chapter 6: Surface treatment technologies to achieve low dielectric properties Chapter 7: Development of substrates with superior low dielectric properties Chapter 8: Evaluation techniques for dielectric properties and physical properties of low dielectric materials －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4 size, 444 pages ●Authors: 44 individuals ●ISBN: 978-4-86798-144-3 －－－－－－－－－－－－－－－－－－－－－

☆Digital technology, drop tower, similarity laws, space chamber, etc. What is the method to recreate the harsh space environment on the ground using existing testing equipment and technology!! －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Characteristics of the space environment and lunar environment Chapter 2: Overview of space law Chapter 3: How to create and reproduce the space environment Chapter 4: How to conduct research and experiments in the space environment Chapter 5: Experiments and development for space and lunar industries －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4 size, 422 pages ●Authors: 62 individuals ●ISBN: 978-4-86798-143-6 －－－－－－－－－－－－－－－－－－－－－

- Hazards of materials / Operational errors / Judgment errors / Deterioration and failure of equipment / Natural disasters - ★ Prevent accidents caused by overly lenient risk assessments and increased costs and decreased productivity due to excessive risk avoidance! ★ Condensed know-how on "Identifying hazards and assessing their risks" and "Judging acceptable risks"!! ---------------------------- ■ Table of Contents Chapter 1: Past Major Accident Cases and Their Analysis Chapter 2: Basics and Applications of Risk Assessment Chapter 3: Risk Assessment and Hazardous Material Management of Chemicals, Processes, and Work Environments Chapter 4: Risk and Safety Assessment of Plants and Accident Countermeasures Chapter 5: Risk-Based Maintenance and Digital Transformation of Maintenance Chapter 6: Simulation Techniques for Accidents and Disasters ---------------------------- ● Publication Date: February 27, 2026 ● Format: A4 size, 538 pages ● Authors: 45 individuals ● ISBN: 978-4-86798-141-2 ----------------------------

★ A comprehensive explanation of scaffold materials from "foundation design to evaluation to application and implementation." ★ A practical book organized by culture style, focusing on the relationship between material properties and cell responses, with an eye toward automated culture and mass production. ★ Not just a review of materials, but an explanation of evaluation techniques, specific indicators, and application examples in product development. －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Utilization of scaffold materials in various cell culture techniques Chapter 2: Scale-up of cell culture processes and specific utilization of scaffold materials Chapter 3: Development of cell culture techniques using microcarriers Chapter 4: Requirements for cell scaffold materials and their evaluation techniques Chapter 5: Specific utilization of scaffold materials in regenerative medicine products Chapter 6: Development trends of scaffold materials －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: February 27, 2026 ● Format: A4 size, 343 pages ● Authors: 51 individuals ● ISBN: 978-4-86798-140-5 －－－－－－－－－－－－－－－－－－－－－

◎The latest technologies for next-generation power devices, semiconductors, automotive equipment, batteries, and motors are all featured in one place! ◎Support for temperatures over 200°C ◎How to use nitride fillers ◎Balancing "insulation" and "heat dissipation" －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Thermal design and heat dissipation for semiconductors, electronic devices, motors, and batteries Chapter 2: High thermal conductivity technology for base resins aimed at heat-dissipating resin design Chapter 3: Surface treatment, dispersion, orientation control of heat-dissipating fillers, and compounding technology with resins Chapter 4: Design of heat-dissipating sheets and technology for improving heat dissipation Chapter 5: Development of high thermal conductivity resin materials for sealing and substrate materials Chapter 6: Measurement, evaluation, and analysis technology for heat dissipation －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: January 30, 2026 ●Format: A4 size, 448 pages ●Authors: 54 individuals ●ISBN: 978-4-86798-129-0 －－－－－－－－－－－－－－－－－－－－－

★ Many companies with accumulated know-how in large-scale cultivation and scale-up have contributed to this work! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Scale-up of Bioreactors and Troubleshooting Chapter 2: Optimization of Cultivation Processes and Media Using AI and Simulation Chapter 3: Design and Operation of Bioreactors Aiming for Low Costs Chapter 4: Commercialization of Bio-manufacturing and Manufacturing Cost Forecasting Chapter 5: Production of Gene Therapy, Regenerative Medicine, and Biopharmaceuticals Using Bioreactors Chapter 6: Design and Scale-up of Downstream Processes for Biopharmaceuticals Chapter 7: Large-scale Cultivation Technology for Microalgae Using Photobioreactors Chapter 8: Optimization of Processes After Microalgae Cultivation (Separation, Drying, Extraction) Chapter 9: Production of Food and Cosmetics Using Bioreactors Chapter 10: Production of Energy and Chemical Products Using Bioreactors, CO2 Reduction －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: January 30, 2026 ● Format: A4, 584 pages ● Authors: 90 individuals ● ISBN: 978-4-86798-128-3 －－－－－－－－－－－－－－－－－－－－－