[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367) [Available for preview]
~Chiplets, Responding to 2.5D/3D High-Density Packaging~
◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli?
◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages.
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■ Table of Contents
Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages
Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion
Chapter 3: Development Trends of Negative Thermal Expansion Materials
Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers
Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates
Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction
Chapter 7: Development of Bonding Materials
Chapter 8: Development Trends of Low CTE Resin Materials
Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials
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● Publication Date: July 31, 2026 ● Format: A4, 395 pages
● Authors: 33 ● ISBN: 978-4-86798-163-4
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