TECHNICAL INFOMATION INSTITUTE CO.,LTD Company Overview

- Visualization, Anomaly Detection, High-Precision Process Optimization - ◎ How can we achieve optimization of film formation and etching processes? ◎ A detailed explanation of the technology that visualizes plasma and connects to the control of electrons and ions! ◎ A thorough explanation of high-precision process technology for discharge and reactive plasma! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Basics of Plasma, Overview of Generation Devices, and Generation/Control Technologies Chapter 2: Design Technologies for Vacuum Environments Chapter 3: Plasma Measurement Technologies, Process Evaluation and Analysis Technologies Chapter 4: Monitoring and Predictive Maintenance Technologies in Plasma Processes Chapter 5: Film Formation Technologies Using Plasma and Low-Temperature Process and Analysis Technologies Chapter 6: Development of Light Sources and Equipment for EUV Lithography Chapter 7: Process Technologies for Plasma Etching and Ashing Chapter 8: Surface Treatment and Cleaning Technologies for Semiconductors Using Plasma －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: June 30, 2026 ● Format: A4, 395 pages ● Authors: 41 ● ISBN: 978-4-86798-156-6 －－－－－－－－－－－－－－－－－－－－－

- Necessary physical property values / Important relationships / Modeling / Utilization of AI - ★ No reliance on experience or intuition! Aiming for fast and accurate 'equipment design' and 'operating condition setting' based on calculation results! ★ Covers everything from the physical property values needed for calculations, important relationships, and modeling to the latest examples of AI utilization! ---------------------------- ■ Table of Contents Chapter 1: Basics of Chemical Engineering Chapter 2: Estimation of Physical Properties Chapter 3: Estimation and Simulation for Stirring, Mixing, Reaction Processes, and Equipment Design Chapter 4: Estimation and Simulation for Separation Processes and Equipment Design Chapter 5: Estimation and Simulation for Drying Processes and Equipment Design Chapter 6: Estimation and Simulation for Powder and Granular Processes and Equipment Design ---------------------------- ● Publication Date: June 30, 2026 ● Format: A4 size, 504 pages ● Authors: 35 contributors ● ISBN: 978-4-86798-157-3 ----------------------------

- Light, Heat, Ultrasound, Electricity, Chemical Reactions - ★ This book explains various methods and material development techniques that demonstrate excellent adhesion during use and allow for easy peeling without damage as needed, along with implementation examples! ---------------------------- ■ Table of Contents Chapter 1: Trends in Easily Disassemblable and Decomposable Materials Chapter 2: Development of Heat-Responsive Easily Disassemblable Materials Chapter 3: Development of Light-Stimuli Responsive Easily Disassemblable Materials Chapter 4: Development of Easily Disassemblable and Decomposable Materials through Chemical Reactions ■ Key Points of This Book ◎ Mechanisms of Adhesion and Peeling ◎ Characteristics of Various External Stimuli ◎ Prospects for Industrial Applications ---------------------------- ● Publication Date: May 29, 2026 ● Format: A4, 360 pages ● Authors: 40 contributors ● ISBN: 978-4-86798-153-5 ----------------------------