TECHNICAL INFOMATION INSTITUTE CO.,LTD Company Overview

◎ A Complete Manual for the Removal of Biofilms to Overcome "Slime" and "Resistance" for the Field! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Mechanisms of Biofilm Formation Chapter 2: Various Evaluation Methods for Biofilms Chapter 3: Evaluation Methods for the Development of Anti-Biofilm Products Chapter 4: Types and Characteristics of Anti-Biofilm Agents Chapter 5: Development of Anti-Biofilm Agents from the Perspective of Bacterial Adhesion Prevention Chapter 6: Mechanisms of Biofilm Formation Inhibition and Development of Anti-Biofilm Agents Chapter 7: Control, Removal, and Prevention Measures for Oral and Infection-Derived Biofilms Chapter 8: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Living Environments Chapter 9: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Food Chapter 10: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Factories, Machinery, and Piping －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: July 31, 2026 ● Format: A4, 384 pages ● Authors: 65 ● ISBN: 978-4-86798-161-0 －－－－－－－－－－－－－－－－－－－－－

- High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions - ★ Explaining the key points for organizing all internal and external data such as molecular structures, images, spectra, and literature/patent information into a usable form for MI! ---------------------------- ■ Table of Contents Chapter 1: Materials Development, Structural Design, and Applications through Materials Informatics Chapter 2: Molecular Design and Reaction Analysis for Materials Development, Descriptorization of Compounds Chapter 3: Optimization of Formulation Conditions, Prediction of Composition Ratios, and Extraction of Reaction Factors Using Machine Learning and Simulation Chapter 4: Collection, Analysis, and Processing of Experimental and Measurement Data for Materials Development and Process Design Chapter 5: Introduction and Operation of Autonomous Experiments and Automation Technologies in Materials Development ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4 size, 425 pages ● Authors: 41 ● ISBN: 978-4-86798-162-7 ----------------------------

~Chiplets, Responding to 2.5D/3D High-Density Packaging~ ◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages. ---------------------------- ■ Table of Contents Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion Chapter 3: Development Trends of Negative Thermal Expansion Materials Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction Chapter 7: Development of Bonding Materials Chapter 8: Development Trends of Low CTE Resin Materials Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4, 395 pages ● Authors: 33 ● ISBN: 978-4-86798-163-4 ----------------------------