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TECHNICAL INFOMATION INSTITUTE CO.,LTD

EstablishmentJuly 7, 1987
capital4600Ten thousand
number of employees22
addressTokyo/Shinagawa/8th Floor, Nikkou Gotanda Building, 2-29-5 Nishi Gotanda
phone03-5436-7744
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last updated:Oct 24, 2023
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TECHNICAL INFOMATION INSTITUTE CO.,LTD Company Overview

We are a technical information association that provides information one step ahead of the times, tailored to our customers' needs.

The Technical Information Association is engaged in the work of shaping information for engineers and researchers. We research what kind of information engineers and researchers active in fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices" need, and we create products such as seminars, books, and correspondence courses!

Business Activities

We support engineers and researchers nationwide as an information dissemination organization for the inheritance of technology and basic education in technical fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices."

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Products/Services (195)

[Book] CO2 Separation, Recovery Technology and Process Design (No. 2376) product image
[Book] CO2 Separation, Recovery Technology and Process Design (No. 2376)
[Book] Utilizing AI for Exploring New Business Themes (No. 2374) product image
[Book] Utilizing AI for Exploring New Business Themes (No. 2374)
[Book] Development of Junction Technology and Materials for Semiconductor Devices (No. 2372) product image
[Book] Development of Junction Technology and Materials for Semiconductor Devices (No. 2372)
[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367) product image
[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367)

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[Book] CO2 Separation and Recovery Technology and Process Design, Effective Utilization Technology (No. 2376)

[Book] CO2 Separation and Recovery Technology and Process Design, Effective Utilization Technology (No. 2376)

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[Book] How to Utilize AI Agents for Exploring New Business Themes and Generating Ideas (No. 2374)

[Book] How to Utilize AI Agents for Exploring New Business Themes and Generating Ideas (No. 2374)

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[Book] Trends in the Development of Semiconductor Device Junction Technology and Materials, and Reliability Evaluation (No. 2372)

[Book] Trends in the Development of Semiconductor Device Junction Technology and Materials, and Reliability Evaluation (No. 2372)

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[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367)

[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367)

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news(385)

2374_表紙画像.jpg

[Book] How to Utilize AI Agents for Exploring New Business Themes and Generating Ideas (No. 2374) [Available for Preview]

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☆From market exploration to hypothesis generation, new application exploration, material improvement, and business proposal, all in one go! ☆What is the method that takes on the vast amount of information collection, organization, and structuring, dramatically enhancing exploration capability and speed! --------------------- ■Key Points of This Book From "AI that generates answers" to "AI that performs tasks" Information collection, idea generation, theme exploration, R&D operations Construction, internal and external data collaboration Legal issues, ethical concerns --------------------- ■Table of Contents Chapter 1: Mechanisms and Features Chapter 2: Addressing Legal Issues and Ethical Concerns Chapter 3: Building AI Agents and Introducing Them to Research and Development Chapter 4: Performance Evaluation and Internal/External Data Collaboration Chapter 5: Approaches to Information Collection and Analysis Chapter 6: Idea Generation and New Business Theme Exploration Chapter 7: Introduction and Case Studies of AI Agents in R&D Operations --------------------- ●Publication Date: September 30, 2026 ●Format: A4, 510 pages ●Authors: 48 ●ISBN: 978-4-86798-165-8 ---------------------

Oct 07, 2026

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[Book] CO2 Separation, Capture Technology and Process Design, Effective Utilization Technology (No. 2376) [Available for Preview]

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~Expansion into DAC, CCUS, Fuels, and Chemicals~ ◎ A thorough explanation of high-efficiency, energy-saving CO2 capture technologies using absorption methods, membrane separation methods, and adsorption methods! ◎ How can we achieve low-energy, low-cost CO2 capture processes? An explanation of design and evaluation case studies! ◎ Detailed insights into the latest trends in CO2 conversion technologies such as e-fuels, methanation, and chemical synthesis! ------------------------------ ■ Table of Contents Chapter 1: Separation and Recovery Technologies for CO2 Using Absorption Methods Chapter 2: Separation and Recovery Technologies Utilizing CO2 Membrane Separation Methods Chapter 3: Separation and Recovery Technologies Utilizing CO2 Physical Adsorption Methods Chapter 4: Trends in DAC and DACCS Chapter 5: Synthesis and Manufacturing Technologies for Fuels Utilizing CO2 Chapter 6: Synthesis Technologies for Useful Chemicals Utilizing CO2 and Effective Utilization Technologies Chapter 7: CO2 Separation and Recovery Processes and Their Application Cases, Demonstration Experiments ------------------------------ ● Publication Date: September 30, 2026 ● Format: A4, 389 pages ● Authors: 46 individuals ● ISBN: 978-4-86798-166-5 ------------------------------

Oct 07, 2026

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[Book] Trends in the Development of Semiconductor Device Junction Technology and Materials, and Reliability Evaluation (No. 2372) [Available for Preview]

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- Surface-active bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesives ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, micro LEDs, etc. Examples of new materials and processes for the development of advanced semiconductors, their possibilities, and verification results are included! ---------------------------- ■ Table of Contents Chapter 1: Bonding and adhesive technologies for advanced semiconductor packages, their material development, and reliability evaluation Chapter 2: Development and reliability evaluation of bonding materials and processes for power semiconductors Chapter 3: Development and reliability evaluation of bonding technologies and materials in electronic devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 423 ● ISBN: 978-4-86798-164-1 ----------------------------

Sep 01, 2026

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Detailed information

Company name TECHNICAL INFOMATION INSTITUTE CO.,LTD
number of employees22
Contact addresspostalcode 141-0031 Tokyo/ Shinagawa/ 8th Floor, Nikkou Gotanda Building, 2-29-5 Nishi GotandaView on map TEL:03-5436-7744 FAX:03-5436-7745
Business LocationsClick here for the list
Industry Service Industry
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