TECHNICAL INFOMATION INSTITUTE CO.,LTD Company Overview

☆Digital technology, drop tower, similarity laws, space chamber, etc. What is the method to recreate the harsh space environment on the ground using existing testing equipment and technology!! －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Characteristics of the space environment and lunar environment Chapter 2: Overview of space law Chapter 3: How to create and reproduce the space environment Chapter 4: How to conduct research and experiments in the space environment Chapter 5: Experiments and development for space and lunar industries －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4 size, 422 pages ●Authors: 62 individuals ●ISBN: 978-4-86798-143-6 －－－－－－－－－－－－－－－－－－－－－

～Responding to high-speed, large-capacity communication and high-speed transmission for AI servers～ ★A comprehensive overview of the development, challenges, and direction for high-frequency compatible semiconductor packaging! ★How to achieve a balance between dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Improvement of low dielectric properties and adhesion of polymer materials through molecular design Chapter 2: Development and application of additives to improve low dielectric properties and adhesion Chapter 3: Development and application of fillers and fiber materials to enhance low dielectric properties Chapter 4: Development of film materials with excellent dielectric properties Chapter 5: Development and application of low dielectric ceramic materials Chapter 6: Surface treatment technologies to achieve low dielectric properties Chapter 7: Development of substrates with superior low dielectric properties Chapter 8: Evaluation techniques for dielectric properties and physical properties of low dielectric materials －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4 size, 444 pages ●Authors: 44 individuals ●ISBN: 978-4-86798-144-3 －－－－－－－－－－－－－－－－－－－－－

~TIM, immersion cooling, vapor chamber, water-cooled heat sink~ ★ Achieving both 'high-density, high-heat cooling' and 'high-efficiency operation' required in data centers, as well as 'instantaneous heat countermeasures' and 'slim design' for AI-equipped PCs and smartphones! ---------------------------- ■ Table of Contents Chapter 1: Market trends for AI and generative AI data centers and the required heat dissipation and cooling technologies Chapter 2: Development of heat dissipation materials and components for electronic devices running AI, HPC, etc., trends, and responses to high heat density Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI ---------------------------- ● Publication Date: March 31, 2026 ● Format: A4, 408 pages ● Authors: 40 ● ISBN: 978-4-86798-145-0 ----------------------------