[Book] Design and Application of Low Dielectric Constant and Low Dielectric Loss Materials (No. 2332) [Available for Preview]
~Responding to high-speed, large-capacity communication and high-speed transmission for AI servers~
★A comprehensive overview of the development, challenges, and direction for high-frequency compatible semiconductor packaging!
★How to achieve a balance between dielectric performance and substrate processability
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■Table of Contents
Chapter 1: Improvement of low dielectric properties and adhesion of polymer materials through molecular design
Chapter 2: Development and application of additives to improve low dielectric properties and adhesion
Chapter 3: Development and application of fillers and fiber materials to enhance low dielectric properties
Chapter 4: Development of film materials with excellent dielectric properties
Chapter 5: Development and application of low dielectric ceramic materials
Chapter 6: Surface treatment technologies to achieve low dielectric properties
Chapter 7: Development of substrates with superior low dielectric properties
Chapter 8: Evaluation techniques for dielectric properties and physical properties of low dielectric materials
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●Publication Date: March 31, 2026 ●Format: A4 size, 444 pages
●Authors: 44 individuals ●ISBN: 978-4-86798-144-3
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