[Book] Design and Application of Low Dielectric Constant and Low Dielectric Loss Materials (No. 2332)
2332 Low dielectric materials
"Available for preview" ~ Responding to high-speed, large-capacity communication and high-speed transmission for AI servers.
★High-frequency compatibility, comprehensive coverage of development, challenges, and directions in the semiconductor packaging field! ★How to achieve a balance between dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■Key points of this document ◆Improvement of low dielectric properties and adhesion of polymer materials ◆Fillers and additives that enhance low dielectric properties ◆Surface treatments that balance low dielectric properties and adhesion ◆Development of low dielectric materials ◆Development of low dielectric materials
Inquire About This Product
basic information
■Table of Contents Chapter 1: Improvement of Low Dielectric Properties and Adhesion of Polymer Materials through Molecular Design Chapter 2: Development and Application of Additives to Improve Low Dielectric Properties and Adhesion Chapter 3: Development and Application of Fillers and Fiber Materials to Improve Low Dielectric Properties Chapter 4: Development of Film Materials with Excellent Dielectric Properties Chapter 5: Development and Application of Low Dielectric Ceramic Materials Chapter 6: Surface Treatment Technologies to Achieve Low Dielectric Properties Chapter 7: Development of Substrates with Excellent Low Dielectric Properties Chapter 8: Evaluation Techniques for Dielectric Properties and Physical Properties of Low Dielectric Materials －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4, 444 pages ●Authors: 44 individuals ●ISBN: 978-4-86798-144-3 －－－－－－－－－－－－－－－－－－－－－
Price information
88,000 yen (including tax) [shipping included] Various discount programs are available. Please contact us.
Price range
P2
Delivery Time
P2
Applications/Examples of results
For more details, please contact us.
catalog（1）
Download All Catalogs![[Book] Design and Application of Low Dielectric Constant and Low Dielectric Loss Materials (No. 2332)](https://image.mono.ipros.com/public/catalog/image/342077/IPROS16909631709621279955.jpeg?w=120&h=170)
News about this product（1）
Company information
The Technical Information Association is engaged in the work of shaping information for engineers and researchers. We research what kind of information engineers and researchers active in fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices" need, and we create products such as seminars, books, and correspondence courses!
