- Publication year : 2026
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~TIM, immersion cooling, vapor chamber, water-cooled heat sink~ ★ Achieving both 'high-density, high-heat cooling' and 'high-efficiency operation' required in data centers, as well as 'instantaneous heat countermeasures' and 'slim design' for AI-equipped PCs and smartphones! ---------------------------- ■ Table of Contents Chapter 1: Market trends for AI and generative AI data centers and the required heat dissipation and cooling technologies Chapter 2: Development of heat dissipation materials and components for electronic devices running AI, HPC, etc., trends, and responses to high heat density Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI ---------------------------- ● Publication Date: March 31, 2026 ● Format: A4, 408 pages ● Authors: 40 ● ISBN: 978-4-86798-145-0 ----------------------------
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~Responding to high-speed, large-capacity communication and high-speed transmission for AI servers~ ★A comprehensive overview of the development, challenges, and direction for high-frequency compatible semiconductor packaging! ★How to achieve a balance between dielectric performance and substrate processability --------------------- ■Table of Contents Chapter 1: Improvement of low dielectric properties and adhesion of polymer materials through molecular design Chapter 2: Development and application of additives to improve low dielectric properties and adhesion Chapter 3: Development and application of fillers and fiber materials to enhance low dielectric properties Chapter 4: Development of film materials with excellent dielectric properties Chapter 5: Development and application of low dielectric ceramic materials Chapter 6: Surface treatment technologies to achieve low dielectric properties Chapter 7: Development of substrates with superior low dielectric properties Chapter 8: Evaluation techniques for dielectric properties and physical properties of low dielectric materials --------------------- ●Publication Date: March 31, 2026 ●Format: A4 size, 444 pages ●Authors: 44 individuals ●ISBN: 978-4-86798-144-3 ---------------------
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☆Digital technology, drop tower, similarity laws, space chamber, etc. What is the method to recreate the harsh space environment on the ground using existing testing equipment and technology!! --------------------- ■Table of Contents Chapter 1: Characteristics of the space environment and lunar environment Chapter 2: Overview of space law Chapter 3: How to create and reproduce the space environment Chapter 4: How to conduct research and experiments in the space environment Chapter 5: Experiments and development for space and lunar industries --------------------- ●Publication Date: March 31, 2026 ●Format: A4 size, 422 pages ●Authors: 62 individuals ●ISBN: 978-4-86798-143-6 ---------------------
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- Hazards of materials / Operational errors / Judgment errors / Deterioration and failure of equipment / Natural disasters - ★ Prevent accidents caused by overly lenient risk assessments and increased costs and decreased productivity due to excessive risk avoidance! ★ Condensed know-how on "Identifying hazards and assessing their risks" and "Judging acceptable risks"!! ---------------------------- ■ Table of Contents Chapter 1: Past Major Accident Cases and Their Analysis Chapter 2: Basics and Applications of Risk Assessment Chapter 3: Risk Assessment and Hazardous Material Management of Chemicals, Processes, and Work Environments Chapter 4: Risk and Safety Assessment of Plants and Accident Countermeasures Chapter 5: Risk-Based Maintenance and Digital Transformation of Maintenance Chapter 6: Simulation Techniques for Accidents and Disasters ---------------------------- ● Publication Date: February 27, 2026 ● Format: A4 size, 538 pages ● Authors: 45 individuals ● ISBN: 978-4-86798-141-2 ----------------------------
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★ A comprehensive explanation of scaffold materials from "foundation design to evaluation to application and implementation." ★ A practical book organized by culture style, focusing on the relationship between material properties and cell responses, with an eye toward automated culture and mass production. ★ Not just a review of materials, but an explanation of evaluation techniques, specific indicators, and application examples in product development. --------------------- ■ Table of Contents Chapter 1: Utilization of scaffold materials in various cell culture techniques Chapter 2: Scale-up of cell culture processes and specific utilization of scaffold materials Chapter 3: Development of cell culture techniques using microcarriers Chapter 4: Requirements for cell scaffold materials and their evaluation techniques Chapter 5: Specific utilization of scaffold materials in regenerative medicine products Chapter 6: Development trends of scaffold materials --------------------- ● Publication Date: February 27, 2026 ● Format: A4 size, 343 pages ● Authors: 51 individuals ● ISBN: 978-4-86798-140-5 ---------------------
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◎The latest technologies for next-generation power devices, semiconductors, automotive equipment, batteries, and motors are all featured in one place! ◎Support for temperatures over 200°C ◎How to use nitride fillers ◎Balancing "insulation" and "heat dissipation" --------------------- ■Table of Contents Chapter 1: Thermal design and heat dissipation for semiconductors, electronic devices, motors, and batteries Chapter 2: High thermal conductivity technology for base resins aimed at heat-dissipating resin design Chapter 3: Surface treatment, dispersion, orientation control of heat-dissipating fillers, and compounding technology with resins Chapter 4: Design of heat-dissipating sheets and technology for improving heat dissipation Chapter 5: Development of high thermal conductivity resin materials for sealing and substrate materials Chapter 6: Measurement, evaluation, and analysis technology for heat dissipation --------------------- ●Publication Date: January 30, 2026 ●Format: A4 size, 448 pages ●Authors: 54 individuals ●ISBN: 978-4-86798-129-0 ---------------------
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★ Many companies with accumulated know-how in large-scale cultivation and scale-up have contributed to this work! --------------------- ■ Table of Contents Chapter 1: Scale-up of Bioreactors and Troubleshooting Chapter 2: Optimization of Cultivation Processes and Media Using AI and Simulation Chapter 3: Design and Operation of Bioreactors Aiming for Low Costs Chapter 4: Commercialization of Bio-manufacturing and Manufacturing Cost Forecasting Chapter 5: Production of Gene Therapy, Regenerative Medicine, and Biopharmaceuticals Using Bioreactors Chapter 6: Design and Scale-up of Downstream Processes for Biopharmaceuticals Chapter 7: Large-scale Cultivation Technology for Microalgae Using Photobioreactors Chapter 8: Optimization of Processes After Microalgae Cultivation (Separation, Drying, Extraction) Chapter 9: Production of Food and Cosmetics Using Bioreactors Chapter 10: Production of Energy and Chemical Products Using Bioreactors, CO2 Reduction --------------------- ● Publication Date: January 30, 2026 ● Format: A4, 584 pages ● Authors: 90 individuals ● ISBN: 978-4-86798-128-3 ---------------------
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