[Book] AI Data Center, Heat Dissipation and Cooling Technology for HPC (No. 2334) [Available for Preview]
~TIM, immersion cooling, vapor chamber, water-cooled heat sink~
★ Achieving both 'high-density, high-heat cooling' and 'high-efficiency operation' required in data centers, as well as 'instantaneous heat countermeasures' and 'slim design' for AI-equipped PCs and smartphones!
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■ Table of Contents
Chapter 1: Market trends for AI and generative AI data centers and the required heat dissipation and cooling technologies
Chapter 2: Development of heat dissipation materials and components for electronic devices running AI, HPC, etc., trends, and responses to high heat density
Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation
Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices
Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI
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● Publication Date: March 31, 2026 ● Format: A4, 408 pages
● Authors: 40 ● ISBN: 978-4-86798-145-0
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