[Book] AI Data Center, Heat Dissipation, Cooling of HPC (No. 2334)

[Available for trial reading] ~ TIM, immersion cooling, vapor chamber, water-cooled heat sink ~

Book Title: AI Data Centers, Heat Dissipation and Cooling Technologies for HPC －－－－－－－－－－－－－－－－－－－－－ ★ Comprehensive coverage of developments, challenges, and directions for high-frequency compatible semiconductor packaging! ★ How to achieve both dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book Application of heat dissipation materials for AI implementation and measures against rapid abnormal heat generation ■ Suppression of thermal strain using negative thermal expansion materials, measures against TIM deformation ■ Application of gap fillers to ultra-high temperature spots occurring at the semiconductor/heat sink interface ■ Achieving long-term durability and reduced thermal resistance using graphite sheets ■ Ensuring bonding reliability of power devices for data centers using Ag sintering bonding materials ■ Measurement techniques for thermal conductivity in the thickness direction, a major pathway for heat dissipation ■ Efficient prediction of the relationship between heat dissipation and electrical properties through simulation ■ Analysis of microscopic stresses inside devices and cracks at joints caused by heat damage Improving thermal transport efficiency through cooling systems and addressing excessive operation ■ Optimal design of complex cooling water flow paths and evaluation of boiling efficiency

Other clean room equipment and facilities