[Book] Trends in the Development of Semiconductor Device Junction Technology and Materials, and Reliability Evaluation (No. 2372) [Available for Preview]
- Surface-active bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesives
◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, micro LEDs, etc.
Examples of new materials and processes for the development of advanced semiconductors, their possibilities, and verification results are included!
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■ Table of Contents
Chapter 1: Bonding and adhesive technologies for advanced semiconductor packages, their material development, and reliability evaluation
Chapter 2: Development and reliability evaluation of bonding materials and processes for power semiconductors
Chapter 3: Development and reliability evaluation of bonding technologies and materials in electronic devices
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● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages
● Authors: 423 ● ISBN: 978-4-86798-164-1
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