[Book] Development of Junction Technology and Materials for Semiconductor Devices (No. 2372)

☆From market exploration to hypothesis generation, new application exploration, material improvement, and business proposal, all in one go! ☆What is the method that takes on the vast amount of information collection, organization, and structuring, dramatically enhancing exploration capability and speed! －－－－－－－－－－－－－－－－－－－－－ ■Key Points of This Book From "AI that generates answers" to "AI that performs tasks" Information collection, idea generation, theme exploration, R&D operations Construction, internal and external data collaboration Legal issues, ethical concerns －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Mechanisms and Features Chapter 2: Addressing Legal Issues and Ethical Concerns Chapter 3: Building AI Agents and Introducing Them to Research and Development Chapter 4: Performance Evaluation and Internal/External Data Collaboration Chapter 5: Approaches to Information Collection and Analysis Chapter 6: Idea Generation and New Business Theme Exploration Chapter 7: Introduction and Case Studies of AI Agents in R&D Operations －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: September 30, 2026 ●Format: A4, 510 pages ●Authors: 48 ●ISBN: 978-4-86798-165-8 －－－－－－－－－－－－－－－－－－－－－

- Surface-active bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesives ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, micro LEDs, etc. Examples of new materials and processes for the development of advanced semiconductors, their possibilities, and verification results are included! ---------------------------- ■ Table of Contents Chapter 1: Bonding and adhesive technologies for advanced semiconductor packages, their material development, and reliability evaluation Chapter 2: Development and reliability evaluation of bonding materials and processes for power semiconductors Chapter 3: Development and reliability evaluation of bonding technologies and materials in electronic devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 423 ● ISBN: 978-4-86798-164-1 ----------------------------