Understanding the hardening behavior makes the measurement and analysis methods clear!
○Publication Date: July 13, 2007 ○Format: B5 size, hardcover, 575 pages ○Price: 60,000 yen (excluding tax) → STbook member price: 56,952 yen (excluding tax) ○Authors: Kiichi Hasegawa, Osaka Municipal Industrial Research Institute Nobuyuki Furukawa, National Institute of Technology, Sasebo College Satoshi Yamazaki, Mitsui Chemicals Polyurethane Co., Ltd. Akihiro Matsumoto, Osaka Municipal Industrial Research Institute Tatsuya Yamagami, The University of Tokyo Takeshi Tanaka, A&D Company, Limited Toru Fuji, Totsuya Echo Co., Ltd. Mikio Akutsu, Cashew Co., Ltd. Yasuyuki Takimoto, Advisor, Photopolymer Discussion Group Kenji Suda, Kawakami Paint Co., Ltd. Motokyo Mito, Osaka City University Koji Adachi, The University of Tokyo Kinji Taki, Shizuoka University Shozo Nakamura, Hiroshima Institute of Technology Masaki Yoshii, Hitachi Chemical Co., Ltd. Jun Sekiguchi, Risotech Japan Co., Ltd. Shuichi Takahashi, AZ Electronic Materials Co., Ltd. Others
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basic information
1. Curing behavior and degree of cure measurement methods for epoxy resin 2. Curing behavior and degree of cure measurement methods for polyimide resin 3. Curing behavior and degree of cure measurement methods for polyurethane resin 4. Curing behavior and degree of cure measurement methods for phenolic resin 5. Drying and curing behavior of micro droplets and measurement and evaluation methods 6. Drying and curing behavior of coating agents and degree of cure measurement methods 7. Curing and drying behavior in converting and measurement of curing and drying degree 8. Curing behavior and degree of cure measurement methods for UV coating agents 9. Curing shrinkage and measurement methods for UV curing resin 10. Curing behavior and degree of cure measurement methods for powder coatings 11. Curing behavior of adhesives 12. Curing behavior and adhesive performance of wood adhesives 13. Thermo-viscoelastic stress analysis for material design of electronic components 14. Curing behavior and curing performance evaluation methods for epoxy resin used in semiconductor package sealing 15. Curing reaction rate equation Others
Price information
Main unit 60,000 yen + tax → STbook member price: 56,952 yen + tax
Price range
P2
Delivery Time
P2
Applications/Examples of results
Resin, curing
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Company information
S&T Publishing publishes technical books aimed at researchers and engineers.
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