[Exhibition at Nepcon Japan 2026] CoaXPress camera that does not require a fan or heat sink. With a low heat generation design, you no longer have to worry about heat management.
We will be exhibiting at NEPCON Japan 2026. □ Event Dates: January 21 (Wednesday) to January 23 (Friday), 2026, 10:00 AM to 5:00 PM □ Venue: Tokyo Big Sight, East Exhibition Hall [E10-37] ~ Main Exhibits ~ - 105MP/245MP ultra-high-resolution sensor equipped CoaXPress area scan camera - 10MP/14MP/21MP ultra-high-speed CoaXPress area scan camera - 8k TDI 1MHz CoaX over Fiber 100G line scan camera - 2k & 4k CoaXPress line scan camera ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊ With the increase in speed and resolution, the power consumption and heat generation of cameras have become significant. Are you not concerned about the impact of heat on the lens affecting inspection accuracy, as well as the influence on the object and surroundings? Japan Bopixel's [low-heat CoaXPress camera] can significantly reduce heat generation as a camera by fundamentally suppressing heat, enabling the realization of a fanless, compact CoaXPress camera.
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■Area Scan Camera 【29×29mm 1Lane Model】0.5M/2M/5.1M/8.1M/12.4M/16.2M/20.4M/24.6M/UV(8.1M) 【40×40mm 1Lane Model】3.2M/5M/8.9M/12M 【60×60mm 4Lane Model】16.2M/20.4M/24.6M 【25M CXP-12×4Lane Model】mono/color/NIR 【65M CXP-6/-12×4Lane Model】mono/color ■Line Scan Camera 【2k CXP-10x1Lane Model】mono/color 【8k CXP-12x4Lane Model】mono/color 【9k CXP-12x4Lane Model】mono TDI line scan 【16k CXP-12x4Lane Model】mono
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Semiconductor front-end/back-end visual inspection, final visual inspection of semiconductor components, visual inspection of assembled boards, various alignments, and industrial image processing focused on semiconductors and electronics.
Detailed information
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[29×29mm 1Lane model] 0.5M/2M/5.1M/8.1M/12.4M/16.2M/20.4M/24.6M
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[40×40mm 1Lane model] 3.2M/5M/8.9M/12M
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[60×60mm 4Lane model] 16.2M/20.4M/24.6M
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[25M CXP12×4Lane model] mono/color
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[65M CXP-6/-12×4Lane model] mono/color
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[8k CXP-12x4Lane model] mono/color
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[9k CXP-12x4Lane model] mono TDI line scan
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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.
