It is a low-viscosity, transparent epoxy resin for laminating. Due to its low viscosity, it is easy to apply and impregnate, and it undergoes initial curing overnight, with the cured material exhibiting heat resistance.
- The curing speed is fast, and if the temperature is above 10°C, initial curing will occur overnight (in 16 hours). - Compared to other resins, epoxy resin has better curing shrinkage, wettability, and mechanical strength. - Due to its low viscosity, application with brushes or rollers and impregnation into non-woven fabrics is easy. - By curing with heat at high temperatures, a more heat-resistant cured product can be obtained. - A transparent cured product is achieved. - It is a low yellowing type with good weather resistance. *Samples are available upon request.
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basic information
This product is a two-component epoxy resin that hardens through a chemical reaction by mixing the main agent and the hardener. Since this product is a chemical, please handle it with sufficient care, attention, and verification based on the actual usage methods before use. Be particularly cautious as it may cause health issues such as skin irritation or poisoning if it comes into contact with the skin or is inhaled. Please check the product safety data sheet before use. Depending on the usage conditions and environment, it may not exhibit its intended performance. Before use, users must conduct preliminary tests to ensure it is suitable for their intended purpose.
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Applications/Examples of results
Usage - Resin for laminated FRP - Adhesives, etc.
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Company information
We respond to requests for product development under customer brands, contributing to the reduction of development costs for our clients. Additionally, we leverage our agility to meet requests for processing outsourcing and OEM contracts. Our company primarily handles adhesives (such as epoxy resins and curing agents like amines), but we also manufacture, sell, and package various liquid resins other than epoxy resin-based adhesives, including OEM services.
