[Data] Shirutoku Report No. 24 #Evaluation and Analysis Methods for BGA Packages
In this report, we will discuss the analysis methods for "BGA packages."
"BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs).
In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side.
You can find more detailed information in related products and catalogs.

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