[Data] Shirutoku Report No. 24 #Evaluation and Analysis Methods for BGA Packages

In this report, we will discuss the analysis methods for "BGA packages."
"BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs).
In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side.
You can find more detailed information in related products and catalogs.

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
Related product
Related catalog(58)
![[Information] Shirutoku Report No. 16 #Preventive Diagnosis is Necessary for Addressing Heat Issues!](https://image.mono.ipros.com/public/catalog/image/01/a24/633388/IPROS45524369331424340743.jpeg?w=120&h=170)
![[Information] Shirutoku Report No. 37 # Introduction of Custom Measurement Services [Microcurrent Detection Edition]](https://image.mono.ipros.com/public/catalog/image/01/4b7/637743/IPROS58262675712973601341.jpeg?w=120&h=170)
![[Information] Shirutoku Report No. 41 # Retrofitted heat measures and additional heat measures are necessary!](https://image.mono.ipros.com/public/catalog/image/01/bfc/639247/IPROS54107035003921323178.jpeg?w=120&h=170)
![[Information] It's Never Too Late to Ask! About EMI Countermeasures: Conducted Emission (Noise Terminal Voltage) Edition](https://image.mono.ipros.com/public/catalog/image/01/aeb/560031/IPROS33943645088455383028.jpeg?w=120&h=170)