Ibaraki Steel Center promotional video released!

A wide range of topics from the basics of cold forging to examples of cost reduction! We also include measures to address the disadvantages of cold forging processing due to our high technical capabilities!

This document provides a thorough explanation of the basics of cold forging, including cost reduction examples and cost estimates. Cold forging is a processing method that shapes metallic materials such as carbon steel, non-ferrous metals, and alloy steel using molds at room temperature, which is below the recrystallization temperature. We will introduce various measures to address the disadvantages of cold forging and key points for cost reduction. We encourage you to read it. 【Contents】 ■ What is cold forging ■ Advantages and disadvantages of cold forging ■ Measures for the disadvantages of cold forging at our company ■ Cost reduction point (1) – Introduction of a 2000-ton press machine ■ Cost reduction point (2) – High technical capabilities *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Differences between "cold forging" and "hot forging" are now available! Technology and equipment capable of handling plate thicknesses from 8mm to 14mm are explained with illustrations and photos!

Our company, which consistently manufactures thick plate press products from material procurement, is offering a free booklet titled "Basic Knowledge on Thick Plate Cold Forging" that condenses explanations and knowledge about "cold forging processing." - What exactly is "cold forging" and what does that process entail...? - I can't explain the difference between "cold forging" and "hot forging"... - I'm curious about what kind of machines are used in thick plate press equipment... We provide comprehensive explanations using technical information, photos, and illustrations to address these inquiries! Additionally, we have included examples of "cold forging products" such as rotors for generators and Mag pulleys for car air conditioners. We encourage you to read and utilize this information! [Contents Included] ■ ISC Thick Plate Processing Manufacturing Process ■ What is Cold Forging? ■ Differences Between Cold Forging and Hot Forging ■ Introduction to Cold Forging Equipment ■ Examples of Cold Forging Implementation *For more details, please refer to the PDF document or feel free to contact us.

• Engine parts

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)