[Free viewing, pre-registration by March 10] We will introduce Primix's emulsification/dispersing/mixing equipment at the Japan Rubber Association online exhibition on March 17!

[Video available] A lab mixer that can rotate and revolve the blades, allowing for uniform mixing, kneading, and vacuum degassing! It also comes with a jacketed container for rapid heating/cooling.

HibisMix® uniformly mixes substances from low viscosity to ultra-high viscosity in a short time. It is a versatile mixer (kneader, agitator) that can handle mixing, kneading, vacuum, heating, cooling, and more. The 2P-03 and 2P-1 models are test machines for research and development, as well as small-scale production machines. They are very popular tabletop mixers that flexibly accommodate a wide range of mixing and kneading needs, with numerous successful scale-up cases to production machines. *The twisting blade of HibisMix® appears in the video below.

• Emulsifier/Disperser
• Mixer/agitator
• Homogenizer

[Video available] An ultra-high-speed multi-stirring system with a maximum rotation speed of 22,000 r/min! It is an emulsification and dispersion testing machine that can accommodate vacuum, continuous, and batch types.

Here are the appealing points of using the Lab Solution® emulsion dispersion testing machine, which is the de facto standard for consolidated evolution! ▼ ▼ ▼ ○ There are plenty of stirring options that can be easily swapped, making it easy to try various configurations during the initial investigation phase. ○ You can select the appropriate model based on the stirring purpose and the processing liquid. ○ The increased motor power allows you to confirm the load condition, providing peace of mind when increasing the rotation speed. Materials that were previously overloaded can be retested. ○ The temperature sensor is standard equipment, and the temperature is displayed on the operation panel. This improves work efficiency compared to testing with a separate thermometer.

• Emulsifier/Disperser
• Mixer/agitator
• Homogenizer

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)