[Magazine Contribution] Featured in the March issue of "Type Technology" - 'IT Tools Utilization Guide 2022'

Initial assessment of moldability based solely on the shape of the part, without considering the mold shape!

"AutoForm-StampingAdviser" is software that allows for the rapid and easy execution of feasibility evaluations for parts and processes, as well as considerations of blank shapes, material yield, and blank costs. It provides feedback on quality issues related to press forming, such as the risks of wrinkles, cracks, and excessive sheet thinning, as well as evaluations of blank unfolding shapes and material costs. 【Features】 ■ Feasibility evaluation of parts and processes ■ Feedback on quality issues related to press forming ■ Predictions of blank shapes and nesting 【Main Functions】 ■ Powerful and flexible configuration options ■ Quick modifications of part shapes ■ Multiple blanking options ■ Use based on parts only or complete die shapes *For more details, please refer to the PDF document or feel free to contact us.

• Press Dies
• Mold Design
• Stress Analysis

You can proceed with the operation step by step throughout the entire process!

"AutoForm-DieDesigner" is software that allows for the rapid creation of alternative designs for die faces throughout the entire press forming process. Once the die face design is created, it can be used for process simulation with AutoForm-FormingSolver. The results can be evaluated with AutoForm-Explorer. By fully integrating die face design with simulation and result evaluation, it enables the quick assessment of multiple alternative process and mold concepts, as well as the selection of optimal concepts regarding formability, quality, and cost. 【Features】 ■ Creation of concept die faces ■ Evaluation of multiple process concept alternatives through direct integration with process simulation ■ Deep understanding and verification of the entire process design 【Main Functions】 ■ Creation of parameterized die face shapes for all processes ■ Creation of excess material based on customized profiles ■ Automatic unfolding of flanges on excess material surfaces ■ Modeling of shapes using morphing technology

• Press Dies
• Mold Design
• Stress Analysis

Since multiple areas can be defined within the mold, the expected correction can be controlled analytically.

The "AutoForm-Compensator" is software that automatically adjusts the die surface based on accurate springback calculations or measured springback data. When the user defines the anticipated correction area, that area is automatically corrected based on the springback calculation results. Using the anticipated correction shape, rapid and accurate die verification can be performed. 【Features】 ■ Reliability in process planning and process engineering ■ Reduction of correction loops ■ No risk of corrections in subsequent processes due to springback 【Main Functions】 ■ User-defined anticipated correction areas ■ Support for free springback and springback fixed by clamps ■ Automatic adjustment of die shapes *For more details, please refer to the PDF document or feel free to contact us.

• Press Dies
• Mold Design
• Stress Analysis

It brings deep understanding and transparency to the molding process from the early engineering stages.

"AutoForm-Sigma" is software that enables the analysis of press-formed parts and processes, as well as the improvement of robustness. It is possible to identify which design parameters affect the quality of parts and to what extent. Additionally, if issues arise during trials or production, it supports the identification of corrective actions. Furthermore, it can also identify ineffective corrective measures and appropriate means that lead to problem resolution. 【Features】 ■ Analytical process improvement ■ Stability and reliability of the forming process ■ Robust manufacturing processes ■ Minimization of defective formed parts ■ Minimization of correction loops and associated costs 【Main Functions】 ■ Automatic variation of design parameters ■ Verification of key design parameters ■ Assessment of noise and variation range of process parameters ■ Evaluation of process capability ■ Automatic execution of multiple simulations *For more details, please refer to the PDF materials or feel free to contact us.

• Press Dies
• Mold Design
• Stress Analysis

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)