[Magazine Contribution] Tool Engineer September Issue Special Edition "Machining Technology to Minimize Waste"

Introducing different approaches aimed at achieving assembly results in press forming engineering!

We will demonstrate, using practical examples, how considering the results of the hemming process in advance during the design of the press forming process can minimize the risk of costly redesigns by incorporating those results into the design. [Contents] - Press forming process considering hemming results - Comparison of individual part springback and subassembly springback - Results of process verification *For more details, please refer to the "Catalog Download." Feel free to contact us with any inquiries.

• 3D CAD
• simulator
• Software (middle, driver, security, etc.)

The digital process twin centered on AutoForm's press die forming analysis has achieved a reduction in development man-hours.

The environment for automobile development is changing more significantly than ever due to societal changes such as electric vehicles and autonomous driving, leading to an increased demand for timely development of products that meet market needs and for reducing labor costs. We will introduce the digital examination method using the digital process twin recommended by AutoForm. [Contents] - Mold estimation and die spotting - Digital estimation and die spotting in AutoForm *For more details, please refer to "Catalog Download."

• Mold Design
• simulator

By realizing a digital twin of the press molding process, we significantly reduce mold trial and production downtime! We are also offering materials that showcase application examples!

We are pleased to present a white paper on the "AutoForm REM Package," which combines software modules for press forming, training, and consulting services to realize a digital twin of the press forming process. [Contents of the White Paper] ■ What is a Robust Engineered Model (REM)? ■ What is the AutoForm REM Package? ■ Benefits of the AutoForm REM Package ■ Seamless digitization of the entire press forming process ■ AutoForm Accuracy Indicators ■ Introduction of application examples *If you would like a copy of the white paper, please request a catalog through "Contact Us" or view it as a PDF from "PDF Download."

• others

AutoForm press and assembly solutions that deliver actual results in digitalization!

As expectations for productivity improvements through digital means grow, AutoForm is also expanding its solutions from press forming simulation to assembly production, including proposals for digital process twins and robust engineering models (REM). This document will explain the important factors in digital considerations for press parts and assembly at AutoForm, as well as provide specific operational methods. 【Contents】 ■ Definition of prediction accuracy in simulation ■ Robust engineering models (REM) and digital process twins ■ Example of Coulomb friction coefficient and TriboForm model ■ Optimization of assembly processes *For more details, please refer to the PDF document or feel free to contact us.

• simulator

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)