This device is designed for manually bonding glass substrates and film substrates.
This is a semi-automatic type that positions and bonds two substrates, such as glass substrates and film substrates. By operating the levers on both sides and monitoring the markers with a CCD camera, high-precision alignment can be easily achieved.
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basic information
【Features】 ● Easy setup, user-friendly operation, and simple maintenance ● Convenient maintenance ● Easy pricing ◎ For more detailed information, please refer to the catalog or contact us directly.
Price information
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Delivery Time
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Applications/Examples of results
Circuit boards for touch panels, etc.
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Company information
Our company utilizes technology backed by the capabilities of highly skilled staff, from the development of various labor-saving devices to design and manufacturing, to provide high-quality and affordable products that satisfy our customers. Please also take a look at the website of Hi-Tech Precision Co., Ltd.