Dicing processing. From dicing to chip tray packing and appearance inspection.
Research and challenge even difficult processing! From dicing to chip tray packing and appearance inspection! Dicing processing by Sahara Techno Industry 【Features】 ○ Skilled in high-difficulty processing for ultra-slim chip ICs, compact ICs, and foreign matter countermeasure ICs ○ High-quality processing through step cutting ○ Chip tray packing using automatic sorting machines ○ High-reliability inspection using metal microscopes ○ Wafer sizes: 4 inches, 5 inches, 6 inches, 8 inches ● For more details, please contact us.
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basic information
Research and challenge even difficult processing! From dicing to chip tray packing and appearance inspection! Dicing processing by Sahara Techno Industry 【Features】 ○ Skilled in high-difficulty processing for ultra-slim chip ICs, compact ICs, and foreign matter countermeasure ICs ○ High-quality processing through step cutting ○ Chip tray packing using automatic sorting machines ○ High-reliability inspection with metal microscopes ○ Wafer sizes: 4 inches, 5 inches, 6 inches, 8 inches ● For more details, please contact us.
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Applications/Examples of results
Main processed products: LCD driver IC, slim chip IC
Company information
Sahara Techno Industry was established in 1971 as a dedicated assembly factory for wristwatches, and later transitioned to the semiconductor sector, utilizing the precision processing technology it had developed. It is a company that continues to contribute to society in line with the flow of the times. Additionally, based on the principles of "diligence," "steadiness," and "harmony," it continues to strive for development by leveraging its technical and application capabilities.
![[Introduction to Processing Technology] Dicing Process](https://image.mono.ipros.com/public/product/image/8e5/2000717360/IPROS62688781017819538931.png?w=280&h=280)
