Contributing to the reduction of the burden on visual inspection operators and improving work efficiency.
The wafer chip visual inspection device has enabled the standardization of inspection criteria for multiple operators through its comprehensive data filing capabilities.
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【Features】 ○ Visual inspection device for wafer and expanding chip appearance using a special high-resolution zoom lens for clear color images monitored visually. ○ Future upgrades to automatic appearance inspection devices are possible. ○ Wafer size: Compatible with 2.4-inch (supports expanding). ○ Equipped with a 1.3 million color image camera: Resolution 1.5μm. ○ Utilizes APO zoom optical system: Variable field of view from 2mm. ○ Simultaneous inspection of multiple chips on one screen. ○ Capable of classifying defective items and image filing. ○ Automatic bad marking function for defective chips. ○ Inspection functions include: Chipping/contamination, foreign objects/cracks/scratches/pattern anomalies/color unevenness. ● For other features and details, please contact us.
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Throughout history, humanity has built up civilization, seeking the next level of lifestyle and measuring technological innovation. At the same time, there is a call to reconsider the Earth's environment and human hearts and cultures. We seek romance in the "advancement of science and technology" and "harmony in human life," and we will devote our limitless creative power to the provision of services, information, and technology, becoming "one body with different forms."