Automatic inspection of all inspection items for wire bonding.
This is an introduction to the automatic appearance inspection device for wire bonding used in power modules, handled by Eiko Sangyo Co., Ltd.
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basic information
【Features】 ○ 3D wire height inspection possible with focus method ○ High-speed inspection: within 2 seconds / 2 fields of view ○ Customizable according to workpiece, inspection items, and inspection accuracy ○ Automatic inspection capability for all inspection items ○ Wire and bond height inspection possible using focus method (camera vertical control imaging) ○ High-precision inspection achieved through optimal combination of camera, lighting, and lens ○ ISO 14001 certified ● For other functions and details, please refer to the catalog.
Price information
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Applications/Examples of results
Inspection Functions - 2D Wire Shape Inspection (Bending, Contact, Breakage) - Ball Shape Inspection (Ball Diameter, Ball Position) - Wire Height Inspection - Chip Inspection (Cracks, Scratches, Foreign Objects, etc.)
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Company information
Throughout history, humanity has built up civilization, seeking the next level of lifestyle and measuring technological innovation. At the same time, there is a call to reconsider the Earth's environment and human hearts and cultures. We seek romance in the "advancement of science and technology" and "harmony in human life," and we will devote our limitless creative power to the provision of services, information, and technology, becoming "one body with different forms."
