Metal base CCL substrate for high-power LEDs
Standard indicator LEDs (bulb-type LEDs) have been primarily used with resin substrates (glass cloth epoxy substrates) due to their low heat generation. However, power LEDs used for lighting applications generate more heat, making metal-based substrates effective for improving LED performance and reliability against heat, as well as extending their lifespan due to their excellent thermal conductivity and cost performance. Well's MCCL substrate is based on a ferrous alloy with excellent heat dissipation, designed to keep the temperature rise of high-power LED elements within a certain range. By utilizing the ferrous alloy base material as a heat sink, it is possible to significantly disperse and dissipate heat generated from the LED, thereby reducing the heat generated by the LED itself and minimizing the decrease in LED lifespan. Additionally, by combining this with Well's heat sink coated with carbon nanotubes, we achieve further improvements in heat dissipation characteristics, leading to an extended lifespan for the LEDs.
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Standard indicator LEDs (bulb-type LEDs) have been primarily used with resin substrates (glass cloth epoxy substrates) due to their low heat generation. However, power LEDs used for lighting applications generate more heat, making metal-based substrates effective for improving LED performance and reliability against heat, as well as extending lifespan due to their excellent heat dissipation and cost performance. Well's MCCL substrate is based on a ferrous alloy with excellent heat dissipation, designed to maintain the temperature rise of high-power LED elements within a certain range. By using a ferrous alloy base material as a heat sink, it is possible to significantly disperse and dissipate heat from the LED, thereby reducing the heat generated by the LED itself and minimizing the decrease in LED lifespan. Additionally, by combining this with Well's heat sink coated with carbon nanotubes, further improvements in heat dissipation characteristics can be achieved, resulting in an extended lifespan for the LEDs.
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●Features -MCCL (Metal Base CCL substrate) * CCL: Copper Clad Layer -L1: Copper foil layer -L2: Insulation layer & adhesive -L3: Iron alloy substrate ●Main Specifications - Substrate thickness: 0.6mm * L1: 35, 70μm (1oz, 2oz) * L2: 50μm * L3: 0.5mm - Thermal conductivity: 20W/m²K - Peel strength (L1-L3): 1.5Kgf/cm ●Main Applications Base substrate for high-power LED modules 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://well-led.jp/mccl.aspx Company Information http://www.welljp.co.jp/
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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