MIC substrate integrated ceramic package
We have developed a millimeter-wave and microwave package that combines an MIC substrate with a ceramic cap processed by microblasting.
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basic information
We have developed a millimeter-wave and microwave package that combines an MIC substrate with a micro-blasting processed ceramic cap.
Price information
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Delivery Time
※It varies depending on the specifications.
Applications/Examples of results
1) A multi-chip package capable of integrating multiple MMICs. 2) The development period can be shortened to one-fifth of that of conventional ceramic packages.
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Company information
Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.