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  6. Narrow pitch pad on beer flexible substrate

Narrow pitch pad on beer flexible substrate

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last updated:May 20, 2026

山下マテリアル
山下マテリアル
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By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

    High frequency/microwave parts
padonvia_001.png

Narrow pitch pad on beer flexible substrate

padonvia_001.png
padonvia_001.png padonvia_002.png padonvia_003.png
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basic information

【Specifications】 Base material: Polyimide (PI), Liquid Crystal Polymer (LCP) Base thickness: 25μm, 50μm Conductor thickness: 14–24μm The recommended conductor thickness varies depending on the via diameter and materials, so individual consultation is required.

Price information

Due to varying prices based on your specifications, please contact us.

Price range

P3

Delivery Time

P4

Applications/Examples of results

Optical communication FPC, etc.

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Narrow pitch pad on beer FPC

Narrow pitch pad on beer FPC

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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