Ideal for thinning sapphire, ceramic, and wafers.
This grinding device demonstrates its power when rapidly processing samples while significantly removing unevenness and thickness, and achieving a flatness level comparable to that of polishing, making it particularly suitable for thinning sapphire, ceramics, and wafers. Specifications: ● Sample diameter: Φ100mm or less ● Flatness: ±10μ ● Grinding amount display: Linear gauge counter, minimum scale 1μ (for automatic grinding)
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This grinding device demonstrates its power when rapidly processing samples while significantly removing unevenness and thickness, and achieving a flatness level comparable to that of polishing, making it particularly suitable for thinning sapphire, ceramics, and wafers. Specifications: ● Sample diameter: Φ100mm or less ● Flatness: ±10μ ● Grinding amount display: Linear gauge counter, minimum scale 1μ (for automatic grinding)
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P4
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In the development of new materials such as semiconductors, organic synthesis materials, optical materials, various ceramics, and electronic materials from conventional general materials, the observation of the fine structural organization of the materials is essential, and optical microscopy is conducted. To achieve this, sample preparation that faithfully represents the structural organization as much as possible is required. Our lapping/polishing technology aims to contribute to production that allows for sample polishing capable of observing fine details more faithfully than conventional methods, as well as high-precision mass production. The materials in the world are diverse and varied, each possessing unique characteristics, and to process them efficiently and easily, it is necessary to find the optimal process suited to each from a wide variety of factors. In other words, it is the "Know-How" of the processing process. If you are considering polishing for anything from small to large items, please feel free to contact us, including mechanical and C.M.P. We are committed to providing the best possible methods.